B32523-Q6155-M EPCOS Inc, B32523-Q6155-M Datasheet - Page 40

B32523-Q6155-M

Manufacturer Part Number
B32523-Q6155-M
Description
Manufacturer
EPCOS Inc
Datasheet

Specifications of B32523-Q6155-M

Tolerance (+ Or -)
20%
Voltage
400VDC/200VAC
Mounting Style
Through Hole
Construction
Radial
Failure Rate
Not Required
Seated Plane Height
20.5mm
Product Diameter (mm)
Not Requiredmm
Product Height (mm)
20.5mm
Product Depth (mm)
11mm
Product Length (mm)
26.5mm
Lead Spacing (nom)
22.5mm
Lead Diameter (nom)
0.8mm
Operating Temp Range
-55C to 125C
Capacitance
1.5uF
Package / Case
Not Required
Lead Free Status / RoHS Status
Compliant
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Important notes
at the end of this document.
Embedding of capacitors in finished assemblies
B32520 ... B32529
General purpose (stacked/wound)
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