60MN36805030K Kemet, 60MN36805030K Datasheet - Page 6

• Manufacturer Part Number: 60MN36805030K
• Manufacturer: Kemet

Specifications of 60MN36805030K

• Tolerance (+ Or -): 10%
• Voltage: 400VDC/200VAC
• Temp Coeff (dielectric): PLYE
• Mounting Style: Through Hole
• Construction: Radial
• Failure Rate: Not Required
• Seated Plane Height: 16mm
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 16mm
• Product Depth (mm): 7mm
• Product Length (mm): 26.5mm
• Lead Spacing (nom): 22.5mm
• Lead Diameter (nom): 0.8mm
• Operating Temp Range: -55C to 105C
• Capacitance: .68uF
• Package / Case: Not Required
• Lead Free Status / RoHS Status: Compliant

eleCTRICAl ChARACTeRISTICS
Rated temperature (T
Temperature derated voltage:
for temperatures between +85°C and +125°C
a decreasing factor of 1.25% per degree °C on the rated
voltage V
Capacitance range:
Capacitance values:
e6 series (IeC 60063 Norm).
Capacitance tolerances (measured at 1 kHz):
Total self-inductance (L): (lead length ~2mm)
Dissipation factor (DF):
tg
Insulation resistance:
Test voltage between terminations:
1.6xV
09/2008
Rated voltage (V
-
δ
kHz
10
1
Test conditions
Temperature:
Voltage charge time:
Voltage charge:
Performance
For V
≥
≥
F
≥
≥
*Typical value
Pitch (mm)
10
3750 M
1250 s
30000 M
10000 s
or V
L(nH) ≈
R
-4
applied for 2 s at +25°C
at +25°C
R
R
≤100 Vdc
>100 Vdc
R
C≤1µF
Ω
(d.c. and a.c.) has to be applied.
≤100
≤150
Ω
for C
for C
for C
for C
10
R
±
9
): 050Vdc - 63Vdc -100Vdc - 160Vdc
5°C
250Vdc - 400Vdc - 630Vdc-1000Vdc .
R
):
≤
>
≤
>
0.33
0.33
0.33
0.33
±
C>1µF
15
10
≤100
5% (J);
+85°C
1000pF to 220
100 Vdc
50 Vdc
µ
µ
µ
µ
1 min
+25°C
F
F
F
F
22.5
18
±
(50000 M
(5000 s)*
(50000 M
(17000 s)*
5°C
±
10% (K);
±
5°C
for V
for V
27.5
18
µ
R
R
F
Ω
Ω
<
≥
)*
)*
100 Vdc
±
100 Vdc
20% (M).
37.5
22
46
MeTAllIZeD POlyeSTeR FIlM CAPACITOR
D.C. MulTIPuRPOSe APPlICATIONS
PRoDUCT CoDe: R60
TeST MeThOD AND PeRFORMANCe
Damp heat, steady state:
endurance:
Resistance to soldering heat:
long term stability (after two years):
RelIABIlITy:
Reference MIL HDB 217
Test conditions
Temperature:
Relative humidity (RH):
Test duration:
Performance
Capacitance change |∆C/C|:
DF change (∆tg
Insulation resistance:
Test conditions
Temperature:
Test duration:
Voltage applied:
Performance
Capacitance change |∆C/C|:
DF change (∆tg
Insulation resistance:
Test conditions
Solder bath temperature:
Dipping time (with heat screen):10 s
Performance
Capacitance change |∆C/C|:
DF change (∆tg
Insulation resistance:
Storage
Performance
Capacitance change |∆C/C|:
Application conditions:
Temperature:
Voltage:
Failure rate:
(1 FIT = 1x10
Failure criteria:
Short or open circuit
Capacitance change |∆C/C|: >10%
DF change (∆tg
Insulation resistance:
: standard environmental conditions (see page 12).
-9
failures/componentsxh)
δ
δ
δ
δ
):
):
):
):
≤
≤
≤
≤
50x10
30x10
50x10
30x10
+40°C
93%
56 days
≤
≤
≥
+105°C
2000 h
1.25xV
≤
≥
+260°C
≤
≥
≤
+40°C
0.5xV
≤
>2xinitial limit.
<0.005xinitial limit.
≤
-4
-4
-4
-4
5%
50x10
50% of initial limit.
5%
50% of initial limit.
2%
3% for C
5 FIT
2% for C
initial limit.
at 10kHz for C
at 01kHz for C
at 10kHz for C
at 01kHz for C
±
R
2%
±
±
±
C
-4
2°C
2°C
±
±
1 s
2°C
5°C
at 1kHz
≤
>
0.1
MKT Series
0.1
R60
µ
µ
F
F
≤
≤
>
>
1
1
1
1
µ
µ
µ
µ
F
F
F
F