B69812N2457B101 EPCOS Inc, B69812N2457B101 Datasheet
B69812N2457B101
Specifications of B69812N2457B101
Related parts for B69812N2457B101
B69812N2457B101 Summary of contents
Page 1
... Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 Dimension Limits , Marking Recommended footprint Page 3 Characteristics Maximum ratings Typical passband characteristic Page 4 Processing information Soldering requirements Delivery mode ISSUE DATE 27.08.03 ISSUE P1 PUBLISHER Filter B69812N2457B101 SAW MWC PD F PAGE 1/4 ...
Page 2
... I/O Pads m ust be connected to lines w ith 50 im pedance. In the application a term ination ust be realized. G round, covered w ith solder resist, connected to low er ground plane b y vias w ith m axim um diam eter of 0.3m m and m ax. distance ISSUE P1 PUBLISHER Filter B69812N2457B101 SAW MWC PD F PAGE 2/4 ...
Page 3
... Operating temperature Typical passband characteristics 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 2,1 2,15 2,2 ISSUE DATE 27.08. 100 SWR 2,25 2,3 2,35 2,4 2,45 frequency [GHz] ISSUE P1 PUBLISHER B69812N2457B101 min. typ. max. 2.450 - 1.4 1.8 0.4 0.8 1.5 2 90/56 °C S21 [dB] ...
Page 4
... Temp. [°C] within 10 sec. 215°C±10°C 20-40 sec. Time [sec.] 2.5 °C/s ISSUE P1 PUBLISHER Filter B69812N2457B101 Profile for leadfree solder paste reflow 260 (max. 2 sec.) °C 250 (max. 10 sec.) °C within 10 sec. 245°C±5°C 30 sec. Time [sec.] > ...