4305-DEMO THAT Corporation, 4305-DEMO Datasheet - Page 19

• Manufacturer Part Number: 4305-DEMO
• Description: Audio Modules & Development Tools Low-Cost Dynamics Processor Demo Board
• Manufacturer: THAT Corporation

Specifications of 4305-DEMO

• Description/function: Audio DSPs
• Operating Supply Voltage: 15 V
• Product: Audio Modules
• For Use With/related Products: THAT4305
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Document 600067 Rev 01
package. The package dimensions are shown in
Figure 23 below, while the pinout is given in Table 1
on page 1.
package. The lead frame is copper, plated with
successive layers of nickel palladium, and gold. This
approach makes it possible to solder these devices
using lead-free and lead-bearing solders. The plastic
mold compound, and the material in which the parts
are packaged, contains no hazardous substances as
Parameter
Package Style
Thermal Resistance
Thermal Resistance
Environmental Regulation Compliance
Soldering Reflow Profile
Figure 23. QSOP-16 surface mount package drawing
The THAT 4305 is available in a 16-pin QSOP
The 4305 is available in a lead-free, "green"
ITEM
J
A
B
C
D
E
G
H
J
1
I
MILLIMETERS
4.80 - 4.98
3.81 - 3.99
5.79 - 6.20
0.20 - 0.30
0.635 BSC
1.35 - 1.75
0.10 - 0.25
0.40 - 1.27
0.19 - 0.25
I
B
C
0-8º
Tel: [phone]; Fax: [phone]; Web: www.thatcorp.com
THAT Corporation; 45 Sumner Street; Milford, MA 01757-1656; USA
D
Package and Soldering Information
Symbol
E
INCHES
0.189 - 0.196
0.150 - 0.157
0.228 - 0.244
0.008 - 0.012
0.025 BSC
0.0532 - 0.0688
0.004 - 0.010
0.016 - 0.050
0.0075 - 0.0098
θ
θ
JC
JA
A
Package Characteristics
H
G
SO package soldered to board
See Fig. 23 for dimensions
SO package in ambient
Conditions
specified in the RoHS directive. For more informa-
tion, including MDDS forms which disclose the
substances contained in our ICs and their packaging,
please visit: www.thatcorp.com/RoHShome.html.
temperatures as high as 260°C for 10 seconds. This
makes them suitable for use in a 100% tin solder
process. Furthermore, the 4305 has been qualified
to a JEDEC moisture sensitivity level of MSL1. No
special humidity precautions are required prior to
flow soldering the parts.
The package has been qualified using reflow
Complies with RoHS requirements
JEDEC JESD22-A113-D (250 ºC)
Min
16 Pin QSOP
Typ
105
40
Max
Page 19 of 20
ºC/W
ºC/W
Units