MAX16974EVKIT+ Maxim Integrated Products, MAX16974EVKIT+ Datasheet - Page 2

• Manufacturer Part Number: MAX16974EVKIT+
• Description: Power Management Modules & Development Tools MAX16974 EVAL KIT MAX16974 EVAL KIT
• Manufacturer: Maxim Integrated Products

Specifications of MAX16974EVKIT+

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

High-Voltage, 2.2MHz, 2A Automotive Step-
Down Converter with Low Operating Current
ABSOLUTE MAXIMUM RATINGS
SUP, SUPSW, EN to GND .....................................-0.3V to +45V
SUP to SUPSW, LX ...............................................-0.3V to +0.3V
BST to GND ..........................................................-0.3V to +47V
BST to LX ...............................................................-0.3V to +6V
OUT to GND ..........................................................-0.3V to +12V
RESETI, FOSC, COMP, BIAS, FSYNC, CRES,
Output Short-Circuit Duration ....................................Continuous
*As per JEDEC 51 standard (multilayer board).
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
ELECTRICAL CHARACTERISTICS
(V
12.1kI, T
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
Shutdown Supply Current
BIAS Regulator Voltage
BIAS Undervoltage Lockout
BIAS Undervoltage Lockout
Hysteresis
Thermal-Shutdown Threshold
OUTPUT VOLTAGE (OUT)
Output Voltage
Skip-Mode Output Voltage
Load Regulation
Line Regulation
BST Input Current
LX Current Limit
Skip-Mode Current Threshold
Junction-to-Ambient Thermal Resistance (q
SUP
RES, FB to GND ..................................................-0.3V to +6V
______________________________________________________________________________________
= V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
A
SUPSW
PARAMETER
= T
J
= -40NC to +125NC, unless otherwise noted. Typical values are at T
= 14V, L1 = 4.7FH, V
V
SYMBOL
V
V
I
OUT_SKIP
SKIP_TH
UVBIAS_
V
UVBIAS
V
V
I
EN
I
HYS
SUP
BIAS
BST
I
SUP
OUT
LX
= 14V, C
JA
) ........38.3°C/W
Normal operation
Normal operation, I
Skip mode, no load, V
V
V
V
Normal operation, V
T
Normal operation, V
-40°C < T
No load, V
V
6V < V
100% duty cycle, V
EN
SUP
BIAS
A
OUT
IN
= +25°C
= 0V
= V
= 5V, V
= 10FF, C
rising
SUP
SUPSW
A
FB
< 28V
<+125°C
FB
= V
CONDITIONS
= V
OUT
= 6V to 42V, V
BIAS
BIAS
LOAD
FB
FB
BST
Continuous Power Dissipation (T
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
= 22FF, C
TSSOP (derate 26.1mW/NC above +70NC) ........... 2088.8mW*
OUT
= V
= V
(Note 2)
; 400mA < I
- V
= 1.5A
BIAS
BIAS
LX
= 5V
= 5V
, I
, I
OUT
LOAD
LOAD
BIAS
LOAD
A
> 6V
= 1FF, C
= 2A,
= 2A,
= +25NC.)
< 2A
BST
MIN
2.85
4.95
4.95
3.5
4.9
4.9
2.5
= 0.1FF, C
A
= +70NC)
TYP
3.05
5.05
0.02
350
175
240
5.1
1.5
35
2
5
5
5
1
3
CRES
MAX
3.25
5.05
5.4
5.1
5.2
3.5
= 1nF, R
28
50
10
3
3
UNITS
FOSC
%/V
mA
mV
mA
mA
FA
FA
NC
%
V
V
V
V
V
A
=