MCT06030D1500BP500 Vishay, MCT06030D1500BP500 Datasheet - Page 8

MCT 0603-25 0.1% P5 150R

MCT06030D1500BP500

Manufacturer Part Number
MCT06030D1500BP500
Description
MCT 0603-25 0.1% P5 150R
Manufacturer
Vishay
Series
MCT 0603r
Datasheet

Specifications of MCT06030D1500BP500

Resistance (ohms)
150
Power (watts)
0.1W, 1/10W
Composition
Thin Film
Temperature Coefficient
±25ppm/°C
Tolerance
±0.1%
Size / Dimension
0.061" L x 0.033" W (1.55mm x 0.85mm)
Height
0.018" (0.45mm)
Lead Style
Surface Mount (SMD - SMT)
Package / Case
0603 (1608 Metric)
Resistance In Ohms
150
Case
0603 (1608 metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
2312 216 71501
231221671501

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCT06030D1500BP500
Manufacturer:
Vishay
Quantity:
15 000
Notes
(1)
(2)
Document Number: 28700
Revision: 18-Dec-09
TEST PROCEDURES AND REQUIREMENTS
4.17.2
4.18.2
4.29
4.32
4.33
4.7
4.35
Special requirements for type MCA 1206
4.25.1
CLAUSE
60115-1
See 4.25.1 (above): special requirements for type MCA 1206
The pulse load stability of professional MFC resistors applies for precision resistors also. However, severe pulse loads are likely to jeopardise
precision stability requirements.
EN
METHOD
60068-2
21 (Ue
21 (Ue
45 (XA)
58 (Td)
58 (Td)
TEST
IEC
-
-
-
-
3
1
)
)
MCS 0402, MCT 0603, MCU 0805, MCA 1206 - Precision
operation mode
operation mode
soldering heat
Resistance to
Endurance at
Endurance at
Voltage proof
Flammability
Solderability
Component
(adhesion)
resistance
Substrate
Precision
Standard
bending
solvent
Shear
70 °C:
70 °C:
TEST
For technical questions, contact:
Precision Thin Film Chip Resistors
whichever is the less severe;
whichever is the less severe;
U =
U =
Stability for product types:
SnPb40; non-activated flux
RR 1005M and RR 1608M;
RR 2012M and RR 3216M;
Isopropyl alcohol + 50 °C;
SnAg3Cu0.5 or SnAg3.5;
(215 ± 3) °C; (3 ± 0.3) s
(235 ± 3) °C; (2 ± 0.2) s
(260 ± 5) °C; (10 ± 1) s
U
needle flame test; 10 s
Depth 2 mm, 3 times
Solder bath method;
Solder bath method;
Solder bath method;
RMS
non-activated flux
P
P
PROCEDURE
IEC 60695-2-2,
70 °C; 1000 h
70 °C; 8000 h
70 °C; 1000 h
70 °C; 8000 h
70
70
= U
method 2
x R
x R
45 N
9 N
ins
; (60 ± 5) s
or U = U
or U = U
MCU 0805
MCA 1206
MCS 0402
MCT 0603
max.
max.
thinfilmchip@vishay.com
;
;
STABILITY CLASS 0.1
no visible damage, no open circuit in bent position
100 Ω to 47.5 kΩ
470 Ω to 10 kΩ
100 Ω to 10 kΩ
47 Ω to 332 kΩ
Good tinning (≥ 95 % covered);
PERMISSIBLE CHANGE (ΔR)
No flashover or breakdown
± (0.05 % R + 0.01 Ω)
± (0.05 % R + 0.01 Ω)
± (0.05 % R + 0.02 Ω)
± (0.25 % R + 0.05 Ω)
No burning after 30 s
± (0.1 % R + 0.02 Ω)
± (0.1 % R + 0.02 Ω)
No visible damage
No visible damage
REQUIREMENTS
no visible damage
Vishay Beyschlag
STABILITY CLASS 0.25
> 47.5 kΩ to 1.5 MΩ
> 10 kΩ to 52.3 kΩ
> 10 kΩ to 511 kΩ
> 332 kΩ to 2 MΩ
39 Ω to < 100 Ω;
39 Ω to < 100 Ω;
39 Ω to < 47 Ω;
www.vishay.com
215

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