SMD Inductors(Coils)
For High Frequency(Multilayer)
MLK Series MLK0603
FEATURES
• Inductance values are supported from 1 to 33nH.
• With the adoption of a giga-spiral laminated structure, self-
• Advanced monolithic structure is formed using a multilayering
• There is no directivity.
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
resonant frequency higher than that of the MLG structure can be
obtained, while the decrease of Q in the GHz band is limited.
and sintering process with ceramic and conductive materials for
high-frequency.
soldering.
Preheating
60 to 120s
0.15±0.05
0.6±0.03
Time(s)
Soldering
30 to 60s
10s max.
Dimensions in mm
Weight: 0.2mg
0.25
Natural
cooling
0.3
0.25
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
SPECIFICATIONS
Operating temperature range
Storage temperature range
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
• After mounting components onto the printed circuit board, do not
• When hand soldering, apply the soldering iron to the printed
MLK 0603 L 10N J
(1)
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
apply stress through board bending or mishandling.
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
0603
2N2
12N
S
J
T
(2)
(3) (4) (5) (6)
T
007-02 / 20101006 / e521_mlk0603.fm
2.2nH
12nH
±0.3nH
±5%
–55 to +125°C
–55 to +125°C
Quantity
15000 pieces/reel
0.6×0.3mm (L×W)
Taping (reel)
Conformity to RoHS Directive
(1/3)