MM5Z5V6ST1G ON Semiconductor, MM5Z5V6ST1G Datasheet - Page 4

• Manufacturer Part Number: MM5Z5V6ST1G
• Description: DIODE ZENER 5.6V 200MW SOD-523
• Manufacturer: ON Semiconductor
• Type: Voltage Regulatorr

Specifications of MM5Z5V6ST1G

• Voltage - Zener (nom) (vz): 5.6V
• Voltage - Forward (vf) (max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 1µA @ 2V
• Power - Max: 200mW
• Impedance (max) (zzt): 40 Ohm
• Mounting Type: Surface Mount
• Package / Case: SOD-523
• Operating Temperature: -65°C ~ 150°C
• Configuration: Single
• Package Type: SOD-523
• Zener Voltage (typ): 5.61V
• Zener Test Current: 5mA
• Voltage Tolerance: 2%
• Power Dissipation: 200mW
• Knee Impedance: 40Ohm
• Operating Temperature Classification: Military
• Rev Curr: 1uA
• Mounting: Surface Mount
• Pin Count: 2
• Operating Temp Range: -65C to 150C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Tolerance: -
• Lead Free Status / Rohs Status: Compliant
• Other names: MM5Z5V6ST1GOS; MM5Z5V6ST1GOS; MM5Z5V6ST1GOSTR

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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D
2 PL
0.08 (0.003)
J
1
M
T
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
X Y
A
S
K
*For additional information on our Pb−Free strategy and soldering
−X−
2
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C
B
SEATING
PLANE
−T−
−Y−
0.0547
1.40
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
MM5Z2V4ST1 SERIES
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
http://onsemi.com
0.0157
0.40
CASE 502−01
SOD−523
ISSUE B
4
SCALE 10:1
0.0157
0.40
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
inches
mm
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
DIM
A
B
C
D
K
J
S
MIN
1.10
0.70
0.50
0.25
0.07
0.15
1.50
MILLIMETERS
NOM
1.20
0.80
0.60
0.30
0.14
0.20
1.60
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MAX
1.30
0.90
0.70
0.35
0.20
0.25
1.70
0.0028
0.043
0.028
0.020
0.010
0.006
0.059
MIN
0.0055
INCHES
0.047
0.032
0.024
0.012
0.008
0.063
NOM
MM5Z2V4ST1/D
0.0079
0.051
0.035
0.028
0.014
0.010
0.067
MAX