AD7817BRUZ Analog Devices Inc, AD7817BRUZ Datasheet - Page 6

• Manufacturer Part Number: AD7817BRUZ
• Description: 14 CH. ADC W/ON-CHIP TEMP SENSOR I.C.
• Manufacturer: Analog Devices Inc

Specifications of AD7817BRUZ

• Function: Temp Monitoring System (Sensor)
• Topology: ADC, Multiplexer, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -40°C ~ 85°C
• Output Type: MICROWIRE™, QSPI™, SPI™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: EVAL-AD7816/7/8EB - BOARD EVALUATION FOR AD7816/7/8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD7816/AD7817/AD7818
ABSOLUTE MAXIMUM RATINGS
(
V
V
Analog Input Voltage to AGND
Reference Input Voltage to AGND
Digital Input Voltage to DGND . . . . . . –0.3 V to V
Digital Output Voltage to DGND . . . . . –0.3 V to V
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
TSSOP, Power Dissipation . . . . . . . . . . . . . . . . . . . . 450 mW
16-Lead SOIC Package, Power Dissipation . . . . . . . . 450 mW
8-Lead SOIC Package, Power Dissipation . . . . . . . . . . 450 mW
T
DD
DD
A
V
θ
Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . 260°C
θ
Lead Temperature, Soldering
θ
Lead Temperature, Soldering
JA
JA
JA
= 25°C unless otherwise noted)
IN1
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 120°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 100°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 157°C/W
to V
IN4
. . . . . . . . . . . . . . . . . . . –0.3 V to V
2
1
. . . –0.3 V to V
DD
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
–6–
µSOIC Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
NOTES
1
2
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
If the Reference Input Voltage is likely to exceed V
during power-up) and the reference is capable of supplying 30 mA or more, it is
recommended to use a clamping diode between the REF
diagram below shows how the diode should be connected.
θ
Lead Temperature, Soldering
JA
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206°C/W
AD7816/AD7817
REF
IN
BAT81
V
DD
DD
by more than 0.3 V (e.g.,
IN
pin and V
DD
REV. C
pin. The