AD8184AR-REEL7 Analog Devices Inc, AD8184AR-REEL7 Datasheet - Page 3

• Manufacturer Part Number: AD8184AR-REEL7
• Description: IC,ANALOG MUX,SINGLE,4-CHANNEL,BIPOLAR,SOP,14PIN,PLASTIC
• Manufacturer: Analog Devices Inc

Specifications of AD8184AR-REEL7

• Rohs Status: RoHS non-compliant
• Function: Video Multiplexer
• Circuit: 1 x 4:1
• On-state Resistance: 33 Ohm
• Voltage Supply Source: Dual Supply
• Voltage - Supply, Single/dual (±): ±4 V ~ 6 V
• Current - Supply: 2.1mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Other names: AD8184AR-REEL7; AD8184AR-REEL7TR

REV. 0
NOTES
1
2
3
4
5
6
7
8
9
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.6 V
Internal Power Dissipation
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
Output Short Circuit Duration . . Observe Power Derating Curves
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec) . . . . . . . +300 C
NOTES
1
2
Model
AD8184AN
AD8184AR
AD8184AR-REEL –40 C to +85 C Reel 14-Lead SOIC
AD8184-EB
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the AD8184
is limited by the associated rise in junction temperature. The maxi-
mum safe junction temperature for plastic encapsulated devices is
determined by the glass transition temperature of the plastic,
approximately +150 C. Exceeding this limit temporarily may
cause a shift in parametric performance due to a change in the
stresses exerted on the die by the package. Exceeding a junction
temperature of +175 C for an extended period can result in
device failure.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8184 feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ENABLE pin is grounded. IN0 and IN2 = +1 V dc, IN1 and IN3 = –1 V dc. A0 is driven with a 0 V to +5 V pulse, A1 is grounded. Measure transition time from 50% of the A0
ENABLE pin is driven with 0 V to +5 V pulse (with 3 ns edges). The state of the A0 and A1 pins determines which input is activated (refer to Table I). Set IN0 and IN2 = +1 V dc,
All inputs are grounded. A0 input is driven with 0 V to +5 V pulse, A1 is grounded. The output is monitored. Speeding the edges of the A0 pulse increases the glitch magnitude
Decreasing R
A resistor (R
Select an input that is not being driven (i.e., A0 and A1 are logic 0, IN0 is selected); drive all other inputs with V
Multiplexer is disabled (i.e., ENABLE = logic 1) and all inputs are driven simultaneously with V
Voltage gain decreases for lower values of R
Larger values of R
input value (+2.5 V) and 10% (or 90%) of the total output voltage transition from IN0 channel voltage (+1 V) to IN1 (–1 V), or vice versa. All inputs are measured in a similar
manner using A0 and A1 to select the channels.
IN1 and IN3 = –1 V dc, and measure transition time from 50% of ENABLE pulse (+2.5 V) to 90% of the total output voltage change. In Figure 4, t
is the enable time.
due to coupling via the ground plane. Removing the A0 and A1 terminations will lower the glitch, as does increasing R
R
late R
load impedance determines the crosstalk.
Stresses above those listed under Absolute Maximum Ratings may cause perma-
Specification is for device in free air: 14-pin plastic package:
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
14-pin SOIC package:
decreases (i.e., the voltage gain is approximately 0.97 V/V [3% gain error] for R
L
AD8184 14-Lead Plastic (N) . . . . . . . . . . . . . . . . 1.6 Watts
AD8184 14-Lead Small Outline (R) . . . . . . . . . . 1.0 Watts
N & R Package . . . . . . . . . . . . . . . . . . . . . –65 C to +125 C
= 2 k (see Figure 12).
ON
of one enabled multiplexer within a system (see Figure 13). In this mode the output impedance is very high (typ 10 M ), and the signal couples across the package; the
S
L
) placed in series with the multiplexer inputs serves to optimize 0.1 dB flatness, but is not required (see Figure 19.)
slightly lowers the bandwidth. Increasing C
L
provide wider output voltage swings, as well as better gain accuracy. See Note 8.
Temperature
Range
–40 C to +85 C 14-Lead Plastic DIP
–40 C to +85 C 14-Lead Narrow SOIC R-14
Evaluation Board For AD8184R
JA
ORDERING GUIDE
= 120 C/Watt, where P
2
L
. The resistive divider formed by the multiplexers enables output resistance (28
Package
Description
1
D
= (T
L
significantly lowers the bandwidth (see Figure 18).
J
–T
A
JA
)/
= 75 C/Watt
JA
.
Package
Option
N-14
R-14
L
= 1 k ).
S
–3–
While the AD8184 is internally short circuit protected, this may
not be sufficient to guarantee that the maximum junction tempera-
ture (+150 C) is not exceeded under all conditions. To ensure
proper operation, it is necessary to observe the maximum power
derating curves shown in Figure 2.
Figure 2. Maximum Power Dissipation vs. Temperature
IN
= 0.446 V rms. Output is monitored at ƒ = 5 and 30 MHz. R
2.5
2.0
1.5
1.0
0.5
–50
–40 –30 –20 –10 0
IN
14-PIN SOIC
= 0.707 V rms and monitor the output at ƒ = 5 and 30 MHz.
L
.
AMBIENT TEMPERATURE – C
) and R
10 20
L
causes a gain that increases as R
WARNING!
14-PIN DIP PACKAGE
30 40 50
OFF
ESD SENSITIVE DEVICE
T
60
is the disable time, t
J
= +150 C
70
L
AD8184
80
= 30
90
L-
to simu-
ON