AD827SQ Analog Devices Inc, AD827SQ Datasheet - Page 9

• Manufacturer Part Number: AD827SQ
• Description: Operational Amplifier (Op-Amp) IC
• Manufacturer: Analog Devices Inc

Specifications of AD827SQ

• Output Current: 20mA
• Input Offset Voltage Max: 0.3mV
• Settling Time: 120ns
• Mounting Type: Through Hole
• Supply Current: 10.5mA
• Operating Temperature Min: -55°C
• Package / Case: 8-CDIP
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Slew Rate: 300 V/µs
• Gain Bandwidth Product: 50MHz
• Current - Input Bias: 3.3µA
• Voltage - Input Offset: 300µV
• Current - Supply: 10.5mA
• Current - Output / Channel: 32mA
• Voltage - Supply, Single/dual (±): ±4.5 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

REV. C
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
4.06 (0.1598)
2.93 (0.1154)
0.56 (0.0220)
0.36 (0.0142)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
(0.2098)
0.10
16-Lead Standard Small Outline Package [SOIC]
MAX
5.33
PIN 1
8-Lead Plastic Dual-in-Line Package [PDIP]
PIN 1
Dimensions shown in millimeters and (inches)
Dimensions shown in millimeters and (inches)
16
1
10.92 (0.4299)
1.27 (0.0500)
8.84 (0.3480)
8
2.54 (0.1000)
10.50 (0.4134)
10.10 (0.3976)
1
BSC
0.51 (0.0201)
0.33 (0.0130)
BSC
1.77 (0.0697)
1.15 (0.0453)
5
4
2.65 (0.1043)
2.35 (0.0925)
7.11 (0.2799)
6.10 (0.2402)
Wide Body
9
8
SEATING
PLANE
1.52 (0.0598)
0.38 (0.0150)
(
(R-16)
(N-8)
SEATING
PLANE
7.60 (0.2992)
7.40 (0.2913)
3.30
(0.1299)
MIN
10.65 (0.4193)
10.00 (0.3937)
0.32 (0.0126)
0.23 (0.0091)
8.25 (0.3248)
7.62 (0.3000)
8
0
0.75 (0.0295)
0.25 (0.0098)
4.95 (0.1949)
2.93 (0.1154)
0.38 (0.0150)
0.20 (0.0079)
OUTLINE DIMENSIONS
1.27 (0.0500)
0.40 (0.0157)
45
–9–
8-Lead Ceramic DIP-Glass Hermetic Seal Package [CERDIP]
9.09 (0.3579)
8.69 (0.3421)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
5.08 (0.2000)
20-Terminal Ceramic Leadless Chip Carrier [LCC]
SQ
5.08 (0.2000)
3.18 (0.1252)
0.58 (0.0228)
0.36 (0.0142)
2.54 (0.1000)
1.63 (0.0642)
2.24 (0.0882)
1.37 (0.0539)
PIN 1
MAX
0.13 (0.0051)
(0.3579)
Dimensions shown in millimeters and (inches)
Dimensions shown in millimeters and (inches)
MAX
MIN
9.09
10.29 (0.4051) MAX
SQ
2.54 (0.1000) BSC
8
1
1.78 (0.0701)
0.76 (0.0299)
1.40 (0.0551)
MAX
1.91 (0.0752)
0.28 (0.0110)
0.18 (0.0071)
2.41 (0.0949)
1.90 (0.0748)
5
4
1.40 (0.0551)
1.14 (0.0449)
R TYP
7.87 (0.3089)
5.59 (0.2201)
1.52 (0.0600)
0.38 (0.0150)
(E-20A)
(Q-8)
(0.0752)
REF
SEATING
PLANE
3.81 (0.1500)
MIN
1.91
REF
19
13
18
14
BOTTOM
20
VIEW
15
3.81 (0.1500)
0
1
8.13 (0.3201)
7.37 (0.2902)
BSC
4
8
3
9
5.08 (0.2000)
BSC
2.54 (0.1000) BSC
AD827
0.38 (0.0150)
0.20 (0.0079)
45 TYP
1.27 (0.0500)
BSC
0.38 (0.0150)
MIN
0.71 (0.0278)
0.56 (0.0220)