ADP171-BL1-EVZ Analog Devices Inc, ADP171-BL1-EVZ Datasheet - Page 16

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ADP171-BL1-EVZ

Manufacturer Part Number
ADP171-BL1-EVZ
Description
Blank ADISimPower Eval ADP171
Manufacturer
Analog Devices Inc
Datasheet

Specifications of ADP171-BL1-EVZ

Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ADP170/ADP171
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP170/ADP171. However, as can be seen from Table 6, a
point of diminishing returns is eventually reached, beyond
which an increase in the copper size does not yield significant
heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
GND
G ND
VIN
Figure 40. Example ADP170 PCB Layout
J1
EN
ANALOG DEVICES
ADP170-x.x-EVALZ
C1
U1
C2
VO UT
G ND
G ND
Rev. B | Page 16 of 20
GND
GND
VIN
Figure 41. Example ADP171 PCB Layout
J1
EN
ADP171-x.x-EVALZ
C1
ANALOG DEVICES
U1
C2
R 2
R 1
VOUT
GND
GND

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