MM5Z5V6T1G ON Semiconductor, MM5Z5V6T1G Datasheet - Page 4

DIODE ZENER 5.6V 200MW SOD-523

MM5Z5V6T1G

Manufacturer Part Number
MM5Z5V6T1G
Description
DIODE ZENER 5.6V 200MW SOD-523
Manufacturer
ON Semiconductor
Datasheet

Specifications of MM5Z5V6T1G

Voltage - Zener (nom) (vz)
5.6V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
1µA @ 2V
Power - Max
200mW
Impedance (max) (zzt)
40 Ohm
Mounting Type
Surface Mount
Package / Case
SOD-523
Operating Temperature
-65°C ~ 150°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Other names
MM5Z5V6T1GOS
MM5Z5V6T1GOS
MM5Z5V6T1GOSTR

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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Email: orderlit@onsemi.com
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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D
2 PL
0.08 (0.003)
J
1
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
T
X Y
A
S
K
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−X−
2
C
B
0.0547
−T−
SEATING
PLANE
1.40
−Y−
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
MM5Z2V4T1 SERIES
http://onsemi.com
0.0157
0.40
CASE 502−01
SOD−523
ISSUE B
4
SCALE 10:1
0.0157
0.40
inches
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
mm
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
DIM
A
B
C
D
J
K
S
MIN
1.10
0.70
0.50
0.25
0.07
0.15
1.50
MILLIMETERS
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NOM
1.20
0.80
0.60
0.30
0.14
0.20
1.60
MAX
1.30
0.90
0.70
0.35
0.20
0.25
1.70
0.0028
0.043
0.028
0.020
0.010
0.006
0.059
MIN
INCHES
0.0055
0.047
0.032
0.024
0.012
0.008
0.063
NOM
MM5Z2V4T1/D
0.0079
0.051
0.035
0.028
0.014
0.010
0.067
MAX

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