NZ9F13VST5G ON Semiconductor, NZ9F13VST5G Datasheet - Page 4

DIODE ZENER 13V 200MW SOT-923

NZ9F13VST5G

Manufacturer Part Number
NZ9F13VST5G
Description
DIODE ZENER 13V 200MW SOT-923
Manufacturer
ON Semiconductor
Datasheet

Specifications of NZ9F13VST5G

Voltage - Zener (nom) (vz)
13V
Voltage - Forward (vf) (max) @ If
900mV @ 10mA
Current - Reverse Leakage @ Vr
100nA @ 10V
Power - Max
200mW
Impedance (max) (zzt)
37 Ohm
Mounting Type
Surface Mount
Package / Case
SOD-923
Operating Temperature
-65°C ~ 150°C
Zener Voltage
13.2 V
Voltage Tolerance
2 %
Voltage Temperature Coefficient
9 mV / K
Power Dissipation
200 mW
Maximum Reverse Leakage Current
0.1 uA
Maximum Zener Impedance
37 Ohms
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NZ9F13VST5G
Manufacturer:
ON Semiconductor
Quantity:
6 300
Part Number:
NZ9F13VST5G
Manufacturer:
ON
Quantity:
30 000
PUBLICATION ORDERING INFORMATION
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Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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c
b
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
2X
0.08 (0.0032) X Y
H
D
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−X−
2
E
−Y−
L
A
0.90
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
http://onsemi.com
0.30
CASE 514AB−01
SOD−923
ISSUE B
DIMENSIONS: MILLIMETERS
4
0.40
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
H
A
b
c
D
E
L
E
MIN
0.34
0.15
0.07
0.75
0.55
0.95
0.05
MILLIMETERS
NOM
0.37
0.20
0.12
0.80
0.60
1.00
0.10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.40
0.25
0.17
0.85
0.65
1.05
0.15
0.013
0.006
0.003
0.030
0.022
0.037
0.002
MIN
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
NZ9F2V4S/D

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