CY7C1347G-166AXC Cypress Semiconductor Corp, CY7C1347G-166AXC Datasheet - Page 13

• Manufacturer Part Number: CY7C1347G-166AXC
• Description: SRAM (Static RAM)
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1347G-166AXC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 4.5M (128K x 36)
• Speed: 166MHz
• Interface: Parallel
• Voltage - Supply: 3.15 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 100-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-2114; CY7C1347G-166AXC

Capacitance
Tested initially and after any design or process changes that may affect these parameters.
Thermal Resistance
Tested initially and after any design or process changes that may affect these parameters.
Document #: 38-05516 Rev. *I
C
C
C
Parameter
Parameter
IN
CLK
IO
OUTPUT
OUTPUT


3.3 V I/O Test Load
JA
JC
2.5 V I/O Test Load
Input capacitance
Clock input capacitance
I/O capacitance
Thermal resistance
(junction to ambient)
Thermal resistance
(junction to case)
Z
Z
0
0
= 50 
= 50 
Description
Description
V
(a)
(a)
V
T
T
= 1.5 V
= 1.25 V
R
R
L
L
= 50 
= 50 
T
V
V
Test conditions follow standard
test methods and procedures for
measuring thermal impedance,
per EIA/JESD51.
OUTPUT
OUTPUT
A
DD
DDQ
3.3 V
2.5 V
= 25 C, f = 1 MHz,
Figure 4. AC Test Loads and Waveforms
= 3.3 V.
= 3.3 V
Including
JIG and
Test Conditions
Test Conditions
Including
scope
JIG and
scope
5 pF
5 pF
(b)
(b)
R = 317 
R = 1667 
R = 351 
R = 1538 
100-pin TQFP
100-pin TQFP
Package
V
30.32
GND
GND
6.85
DDQ
V
Max
DDQ
5
5
5
 1 ns
 1 ns
10%
10%
119-ball BGA
119-ball BGA
Package
34.1
14.0
Max
All input pulses
All input pulses
90%
90%
5
5
7
(c)
(c)
165-ball FBGA
165-ball FBGA
Package
CY7C1347G
20.3
Max
4.6
5
5
7
90%
90%
Page 13 of 24
10%
10%
 1 ns
 1 ns
C/W
C/W
Unit
Unit
pF
pF
pF
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