CY7C1515V18-250BZC Cypress Semiconductor Corp, CY7C1515V18-250BZC Datasheet - Page 10

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CY7C1515V18-250BZC

Manufacturer Part Number
CY7C1515V18-250BZC
Description
SRAM (Static RAM)
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1515V18-250BZC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
72M (2M x 36)
Speed
250MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-TFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1515V18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Application Example
Figure 1
Truth Table
The truth table for CY7C1511V18, CY7C1526V18, CY7C1513V18, and CY7C1515V18 follows.
Notes
Document Number: 38-05363 Rev. *F
Write Cycle:
Load address on the rising
edge of K; input write data
on two consecutive K and
K rising edges.
Read Cycle:
Load address on the rising
edge of K; wait one and a
half cycle; read data on
two consecutive C and C
rising edges.
NOP: No Operation
Standby: Clock Stopped
2. X = “Don't Care,” H = Logic HIGH, L = Logic LOW,
3. Device powers up deselected with the outputs in a tri-state condition.
4. “A” represents address location latched by the devices when transaction was initiated. A + 1, A + 2, and A +3 represents the address sequence in the burst.
5. “t” represents the cycle at which a read/write operation is started. t + 1, t + 2, and t + 3 are the first, second and third clock cycles respectively succeeding the “t” clock cycle.
6. Data inputs are registered at K and K rising edges. Data outputs are delivered on C and C rising edges, except when in single clock mode.
7. It is recommended that K = K and C = C = HIGH when clock is stopped. This is not essential, but permits most rapid restart by overcoming transmission line charging
8. If this signal was LOW to initiate the previous cycle, this signal becomes a “Don’t Care” for this operation.
9. This signal was HIGH on previous K clock rise. Initiating consecutive read or write operations on consecutive K clock rises is not permitted. The device ignores the
MASTER
symmetrically.
second read or write request.
ASIC)
(CPU
BUS
or
Operation
shows four QDR-II used in an application.
CLKIN/CLKIN#
Delayed K#
DATA OUT
Delayed K
Source K#
Source K
Address
DATA IN
BWS#
WPS#
RPS#
Vt
R
R
Stopped
L-H
L-H
L-H
K
R = 50ohms
D
A
RPS WPS
H
L
H
X
[9]
[8]
L
represents rising edge.
R
P
S
#
Vt = Vddq/2
X
H
X
[9]
W
P
S
#
SRAM #1
Figure 1. Application Example
W
B
S
#
D(A) at K(t + 1)↑ D(A + 1) at K(t + 1)↑ D(A + 2) at K(t + 2)↑ D(A + 3) at K(t + 2)↑
Q(A) at C(t + 1)↑ Q(A + 1) at C(t + 2)↑ Q(A + 2) at C(t + 2)↑ Q(A + 3) at C(t + 3)↑
D = X
Q = High-Z
Previous State
C C#
DQ
CQ/CQ#
K
ZQ
K#
Q
R = 250ohms
D = X
Q = High-Z
Previous State
DQ
CY7C1513V18, CY7C1515V18
CY7C1511V18, CY7C1526V18
D
A
R
D = X
Q = High-Z
Previous State
Vt
Vt
R
P
S
#
[2, 3, 4, 5, 6, 7]
W
P
S
#
DQ
W
B
S
#
SRAM #4
C C#
CQ/CQ#
D = X
Q = High-Z
Previous State
K
ZQ
K#
Q
Page 10 of 32
R = 250ohms
DQ
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