BAS28,215 NXP Semiconductors, BAS28,215 Datasheet
BAS28,215
Specifications of BAS28,215
933679170215
BAS28 T/R
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BAS28,215 Summary of contents
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BAS28 High-speed double diode Rev. 3 — 22 July 2010 1. Product profile 1.1 General description Two high-speed switching diodes fabricated in planar technology, and encapsulated in a small SOT143B Surface-Mounted Device (SMD) plastic package. The diodes are not connected. ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BAS28 4. Marking Table 4. Type number BAS28 [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BAS28 Product data sheet Pinning Description cathode (diode 1) cathode (diode 2) anode (diode 2) anode (diode 1) ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM Per device P tot stg [1] Device mounted on an FR4 PCB. [2] One diode loaded °C prior to surge. [ Thermal characteristics Table 6. Symbol Per device; one diode loaded ...
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... NXP Semiconductors 7. Characteristics Table amb Symbol Per diode [1] When switched from I [2] When switched from I 300 I F (mA ) (1) 200 100 150 °C; typical values ( °C; typical values ( °C; maximum values ( Fig 1. Forward current as a function of forward voltage BAS28 Product data sheet Characteristics ° ...
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... NXP Semiconductors (nA 100 Rmax ( maximum values R ( typical values R ( typical values R Fig 3. Reverse current as a function of junction temperature Fig 5. Forward current as a function of ambient temperature; derating curve BAS28 Product data sheet mga884 C (pF ) 200 ( ° Fig 4. 250 I F (mA) 200 150 100 100 All information provided in this document is subject to legal disclaimers. Rev. 3 — ...
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... NXP Semiconductors 8. Test information D.U. Ω × ( Fig 6. Reverse recovery time test circuit and waveforms I 450 Ω 1 kΩ Ω D.U.T. Fig 7. Forward recovery voltage test circuit and waveforms 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications ...
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... NXP Semiconductors 9. Package outline Fig 8. 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BAS28 [1] For further information and the availability of packing methods, see BAS28 Product data sheet 4 2.5 1.4 2.1 1 ...
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... NXP Semiconductors 11. Soldering 0.7 (3×) 0.7 Fig 9. 4.6 Fig 10. Wave soldering footprint BAS28 (SOT143B) BAS28 Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 Reflow soldering footprint BAS28 (SOT143B) 4.45 2.2 2.575 1.2 All information provided in this document is subject to legal disclaimers. ...
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... Release date BAS28 v.3 20100722 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 1.1 “General • Section 4 • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 10 Packing information ...