MBRF30H60CTG ON Semiconductor, MBRF30H60CTG Datasheet
MBRF30H60CTG
Specifications of MBRF30H60CTG
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MBRF30H60CTG Summary of contents
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... MBRB30H60CT-1G, MBR30H60CTG, MBRF30H60CTG, MBRB30H60CTT4G SWITCHMODE™ Power Rectifier Features and Benefits • Low Forward Voltage • Low Power Loss/High Efficiency • High Surge Capacity • 175°C Operating Junction Temperature • Total (15 A Per Diode Leg) • Guard−Ring for Stress Protection • ...
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... Voltage Rate of Change (Rated Controlled Avalanche Energy (see test conditions in Figures 11 and 12) ESD Ratings: Machine Model = C Human Body Model = 3B THERMAL CHARACTERISTICS Maximum Thermal Resistance (MBRB30H60CT−1G and MBR30H60CTG) − Junction−to−Case (MBRF30H60CTG) (MBRB30H60CTTRG) ELECTRICAL CHARACTERISTICS Maximum Instantaneous Forward Voltage (Note 25° ...
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T = 125° 25° 0.1 0 0.2 0.4 0 INSTANTANEOUS FORWARD VOLTAGE (V) F Figure 1. Typical Forward Voltage 1.0E−01 1.0E− 125°C J 1.0E−03 1.0E− 25°C J ...
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... Figure 9. Thermal Response Junction−to−Case for MBRB30H60CT−1G, MBR30H60CTG and 0.5 1 0.2 0.1 0.05 0.1 0.01 0.01 SINGLE PULSE 0.001 0.000001 0.00001 0.0001 Figure 10. Thermal Response Junction−to−Case for MBRF30H60CTG 10,000 1000 100 150 160 170 180 0 0.001 0.01 0 TIME (sec) 1 MBRB30H60CTT4G 0 ...
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COIL MERCURY SWITCH DUT S 1 Figure 11. Test Circuit The unclamped inductive switching circuit shown in Figure 11 was used to demonstrate the controlled avalanche capability of this device. A mercury ...
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... CASE 418D AYWW B30H60G AKA ORDERING INFORMATION Device MBRB30H60CT−1G MBR30H60CTG MBRF30H60CTG MBRB30H60CTT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. MARKING DIAGRAMS TO−220 TO−220 CASE 221D ...
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−T− SEATING K PLANE 0.13 (0.005 PACKAGE ...
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... PLANE 0.13 (0.005 STYLE 1: PIN 1. BASE VARIABLE CONFIGURATION ZONE VIEW W−W 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS 2 D PAK 3 CASE 418B−04 ISSUE STYLE 2: STYLE 3: PIN 1 ...
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... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...