Thermal Characteristics
Electrical Characteristics
Maximum Ratings
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Reverse Breakdown Voltage (Note 2)
Forward Voltage
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
Features
•
•
•
•
•
•
Notes:
MMBD4448HTM
Document number: DS30302 Rev. 7 - 2
Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Notes 4 and 5)
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
Date Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants
Characteristic
Characteristic
Characteristic
@T
A
= 25°C unless otherwise specified
@T
A
TOP VIEW
= 25°C unless otherwise specified
@ t = 1.0μs
@ t = 1.0s
www.diodes.com
SOT-26
Symbol
V
1 of 3
(BR)R
C
V
I
t
R
rr
F
T
Mechanical Data
T
SURFACE MOUNT FAST SWITCHING DIODE ARRAY
Symbol
Symbol
V
•
•
•
•
•
•
•
•
•
J
V
V
R(RMS)
R
V
I
, T
I
RWM
V
FSM
P
RRM
FM
I
RM
θ JA
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O
R
D
STG
Case: SOT-26
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
Orientation: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.016 grams (approximate)
0.62
Min
80
⎯
⎯
⎯
⎯
⎯
⎯
Internal Schematic
TOP VIEW
0.855
Max
0.72
1.25
100
1.0
3.5
4.0
⎯
50
30
25
-65 to +150
Value
Value
Unit
100
500
250
350
357
4.0
2.0
nA
μA
μA
nA
pF
80
57
ns
V
V
I
I
I
I
I
V
V
V
V
V
V
R
F
F
F
F
R
R
R
R
R
R
= 5.0mA
= 10mA
= 100mA
= 150mA
= 2.5μA
= 70V
= 75V, T
= 25V, T
= 20V
= 6, f = 1.0MHz
= 6V, I
MMBD4448HTM
Test Condition
F
= 5mA
J
J
= 150°C
= 150°C
© Diodes Incorporated
°C/W
Unit
Unit
mW
mA
mA
°C
V
V
V
A
March 2008