G3VM-61BR Omron, G3VM-61BR Datasheet - Page 4

• Manufacturer Part Number: G3VM-61BR
• Description: MOSFET TH Relay
• Manufacturer: Omron
• Series: G3VMr

Specifications of G3VM-61BR

• Circuit: SPST-NO (1 Form A)
• Output Type: AC, DC
• On-state Resistance: 100 mOhm
• Load Current: 2.5A
• Voltage - Input: 1.33VDC
• Voltage - Load: 0 ~ 60 V
• Mounting Type: Through Hole
• Termination Style: PC Pin
• Package / Case: 6-DIP (0.300", 7.62mm)
• Control Voltage Range: 1.18 V to 1.48 V
• Load Voltage Rating: 60 V
• Off State Leakage Current (max): 1 uA
• Load Current Rating: 2500 mA
• Contact Form: 1 Form A
• Output Device: MOSFET
• Mounting Style: PCB
• Relay Type: MOSFET Relay
• Turn-on Switching: FET
• Load Voltage Max: 60V
• On State Resistance Max: 0.1ohm
• Contact Configuration: SPST-NO
• Forward Current If: 30mA
• Relay Terminals: Through Hole
• Svhc: No SVHC (20-Jun-2011)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: G3VM61BR; Z2442

■ Solder Mounting
Perform solder mounting under the following recommended conditions
to prevent the temperature of the relays from rising, causing possible
damage to the relays.
Flow Soldering
Through Hole Packages (Once only)
Note: It is recommended that the suitability of solder mounting be
Reflow Soldering
Surface Mount Packages (Twice max.)
*Measured from the top surface of the relay package
Note: 1. It is recommended that the suitability of solder mounting be
Manual Soldering (Once only)
Manually solder at 350°C for 3s or less or at 260°C for 10s or less.
4
Lead solder
(SnPb)
Lead-free solder
(SnAgCu)
Lead solder
(SnPb)
Lead-free solder
(SnAgCu)
Solder type
Solder type
verified under actual conditions
2. Tape cut SSOP’s are packaged without humidity resistance.
verified under actual conditions
Use manual soldering to mount them.
MOS FET Relays
140 to 160°C,
60 to 120s
180 to 190°C,
60 to 120s
150°C,
60 to 120s
150°C,
60 to 120s
Temperature*
Temperature
Preheating
Preheating
260°C,
10s max.
260°C,
10s max.
210°C,
30s max.
230°C,
30 to 50s
Technical Information
Temperature*
Temperature
Soldering
Solder
Peak,
240°C max.
Peak,
260°C max.
SSOP Handling Precautions
Humidity-resistant Packaging
Component cases can crack if surface-mounted components that
have absorbed moisture are subjected to thermal stress when
mounting. To prevent this, observe the following precautions.
1. Unopened components can be stored in the packaging at
2. After the packaging has been opened, components can be
3. If, after opening the packaging, the humidity indicator turns
4. If the same components are baked repeatedly, then the tape
5. When mounting using dehumidifying measures, always take
6. Do not throw or drop the components. If the laminated pack-
7. Tape cut SSOP’s are packaged without humidity resistance.
5 to 30°C and a humidity of 90% max. However, they should
be used within 12 months.
stored at 5 to 30°C and a humidity of 70% max. However, they
should be mounted within 168 hours.
pink to the 30% mark or the expiration date is exceeded, then
bake the components while they are still on the taping reel
and use them within 72 hours. Do not bake the same compo-
nents more than once.
detachment strength will change, causing potential problems
when mounting. Use caution when mounting under these
conditions.
countermeasures against component damage from static
electricity.
aging material is damaged, airtightness will be lost.
Use manual soldering to mount them.
Baking conditions: 60 ± 5°C, 64 to 72 hours