BAS16XV2T1G ON Semiconductor, BAS16XV2T1G Datasheet - Page 3

• Manufacturer Part Number: BAS16XV2T1G
• Description: DIODE SWITCH 200MA 75V SOD523
• Manufacturer: ON Semiconductor

Specifications of BAS16XV2T1G

• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 75V
• Current - Average Rectified (io): 200mA (DC)
• Current - Reverse Leakage @ Vr: 1µA @ 75V
• Diode Type: Standard
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 6ns
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SOD-523
• Product: Switching Diodes
• Peak Reverse Voltage: 75 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 0.5 A
• Configuration: Single
• Recovery Time: 6 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 1 uA
• Operating Temperature Range: - 55 C to + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Mounting Style: SMD/SMT
• Rectifier Type: Small Signal Switching Diode
• Peak Rep Rev Volt: 75V
• Avg. Forward Curr (max): 0.2A
• Rev Curr: 1uA
• Peak Non-repetitive Surge Current (max): 0.5A
• Forward Voltage: 1.25V
• Operating Temp Range: -55C to 150C
• Package Type: SOD-523
• Rev Recov Time: 6ns
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: BAS16XV2T1GOSTR

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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D
2 PL
0.08 (0.003)
J
1
M
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
T
X Y
A
S
K
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−X−
2
C
B
SEATING
PLANE
−T−
−Y−
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.0547
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SOLDERING FOOTPRINT*
1.40
http://onsemi.com
CASE 502−01
SOD−523
0.0157
ISSUE C
0.40
3
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
1982.
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
DIM
A
B
C
D
K
S
J
0.0157
0.40
MIN
1.10
0.70
0.50
0.25
0.07
0.15
1.50
inches
mm
MILLIMETERS
NOM
1.20
0.80
0.60
0.30
0.14
0.20
1.60
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.30
0.90
0.70
0.35
0.20
0.25
1.70
0.0028
0.043
0.028
0.020
0.010
0.006
0.059
MIN
INCHES
0.0055
0.047
0.032
0.024
0.012
0.008
0.063
NOM
BAS16XV2T1/D
0.0079
0.051
0.035
0.028
0.014
0.010
0.067
MAX