NSD914XV2T1G ON Semiconductor, NSD914XV2T1G Datasheet

NSD914XV2T1G

Manufacturer Part Number

NSD914XV2T1G

Description

DIODE SW 120MW 100V HS SOD523

Manufacturer

ON Semiconductor

Datasheet

1.NSD914XV2T1G.pdf (3 pages)

Specifications of NSD914XV2T1G

Voltage - Forward (vf) (max) @ If

1V @ 10mA

Voltage - Dc Reverse (vr) (max)

100V

Current - Average Rectified (io)

200mA (DC)

Current - Reverse Leakage @ Vr

5µA @ 75V

Diode Type

Standard

Speed

Small Signal =< 200mA (Io), Any Speed

Reverse Recovery Time (trr)

4ns

Capacitance @ Vr, F

4pF @ 0V, 1MHz

Mounting Type

Surface Mount

Package / Case

SOD-523

Product

Switching Diodes

Peak Reverse Voltage

100 V

Forward Continuous Current

0.2 A

Max Surge Current

0.5 A

Configuration

Single

Recovery Time

4 ns

Forward Voltage Drop

1 V

Maximum Reverse Leakage Current

5 uA

Operating Temperature Range

+ 150 C

Maximum Operating Temperature

+ 150 C

Mounting Style

SMD/SMT

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

NSD914XV2T1GOSTR

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

NSD914XV2T1G

Manufacturer:

Quantity:

18 000

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

NSD914XV2T1G

Manufacturer:

ON Semiconductor

Quantity:

7 950

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

NSD914XV2T1G

Manufacturer:

Quantity:

30 000

Company:

Meier Automation Equipment Co., Limited

Part Number:

NSD914XV2T1G

Manufacturer:

ON/安森美

Quantity:

20 000

Company:

Allchip Electronic(HK) Limited

Part Number:

NSD914XV2T1G

Manufacturer:

Quantity:

15 706

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NSD914XV2T1

High−Speed

Switching Diode

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

MAXIMUM RATINGS

December, 2006 − Rev. 3

THERMAL CHARACTERISTICS

1. FR−4 @ Minimum Pad.

OFF CHARACTERISTICS

Reverse Voltage

Forward Current

Peak Forward Surge Current

Total Device Dissipation FR−5 Board (Note 1)

Thermal Resistance

Junction and Storage Temperature

Reverse Breakdown Voltage

Reverse Voltage Leakage Current

Diode Capacitance

Forward Voltage

Reverse Recovery Time

High−Speed Switching Applications

Lead Finish: 100% Matte Sn (Tin)

Qualified Maximum Reflow Temperature: 260°C

Extremely Small SOD−523 Package

Pb−Free Package is Available

Derate above 25°C

Junction-to-Ambient

= 10 mAdc)

= I

= 20 Vdc)

= 75 Vdc)

= 0 V, f = 1.0 MHz)

= 100 mAdc)

= 25°C

= 10 mAdc)

Characteristic

Rating

= 25°C)

Preferred Device

Symbol

FM(surge)

(BR)

, T

qJA

stg

Min

100

−

Max

1.57

100

200

500

200

635

150

Max

5.0

4.0

1.0

4.0

−

mW/°C

mAdc

°C/W

Unit

°C

nAdc

mAdc

Unit

Vdc

†For information on tape and reel specifications,

Preferred devices are recommended choices for future use

and best overall value.

NSD914XV2T1

NSD914XV2T1G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

Device

CASE 502

SOD−523

PLASTIC

(Note: Microdot may be in either location)

ORDERING INFORMATION

CATHODE

= Specific Device Code

= Date Code

= Pb−Free Package

http://onsemi.com

(Pb−Free)

SOD−523

Package

Publication Order Number:

ANODE

MARKING

DIAGRAM

3000/Tape & Reel

NSD914XV2T1/D

5D MG

Shipping†

Related parts for NSD914XV2T1G

NSD914XV2T1G Summary of contents

Page 1

... Symbol Max Unit P D 200 mW 1.57 mW/°C °C/W 635 R qJA NSD914XV2T1 NSD914XV2T1G ° 150 J stg †For information on tape and reel specifications, including part orientation and tape sizes, please Symbol Min Max Unit refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. ...

Page 2

V 2 100 μH F 0.1 μF DUT 50 Ω OUTPUT PULSE GENERATOR Notes 2.0 kΩ variable resistor adjusted for a Forward Current (I Notes: 2. Input pulse is adjusted so I Notes: ...

Page 3

... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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