NSR0320XV6T1G ON Semiconductor, NSR0320XV6T1G Datasheet - Page 3

DIODE SCHOTTKY 200MW 23V SOT563

NSR0320XV6T1G

Manufacturer Part Number
NSR0320XV6T1G
Description
DIODE SCHOTTKY 200MW 23V SOT563
Manufacturer
ON Semiconductor
Datasheets

Specifications of NSR0320XV6T1G

Voltage - Forward (vf) (max) @ If
500mV @ 900mA
Voltage - Dc Reverse (vr) (max)
23V
Current - Average Rectified (io)
1A (DC)
Current - Reverse Leakage @ Vr
50µA @ 15V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Capacitance @ Vr, F
35pF @ 5V, 1MHz
Mounting Type
Surface Mount
Package / Case
SOT-563, SOT-6
Product
Schottky Diodes
Peak Reverse Voltage
23 V
Forward Continuous Current
1 A
Max Surge Current
7.5 A
Configuration
Single Dual Anode Quad Cathode
Forward Voltage Drop
0.5 V @ 0.9 A
Maximum Reverse Leakage Current
50 uA @ 15 V
Operating Temperature Range
+ 125 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
NSR0320XV6T1GOS
NSR0320XV6T1GOS
NSR0320XV6T1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NSR0320XV6T1G
Manufacturer:
ON Semiconductor
Quantity:
2 850
Part Number:
NSR0320XV6T1G
Manufacturer:
ON
Quantity:
45 000
Part Number:
NSR0320XV6T1G
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
6
1
e
−X−
D
5
2
4
3
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
0.08 (0.003)
−Y−
6 5 PL
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
X
Y
0.0531
1.35
A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
NSR0320XV6T1
http://onsemi.com
SOT−563, 6 LEAD
H
C
CASE 463A−01
L
E
0.0197
0.0118
0.5
ISSUE F
0.3
0.0394
1.0
3
0.0197
0.5
SCALE 20:1
0.0177
0.45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
inches
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
STYLE 5:
mm
DIM
H
PIN 1. CATHODE
A
C
D
E
b
e
L
E
2. CATHODE
3. ANODE
4. ANODE
5. CATHODE
6. CATHODE
MIN
0.50
0.17
0.08
1.50
1.10
0.10
1.50
MILLIMETERS
0.5 BSC
NOM
0.55
0.22
0.12
1.60
1.20
0.20
1.60
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.60
0.27
0.18
1.70
1.30
0.30
1.70
0.020
0.007
0.003
0.059
0.043
0.004
0.059
MIN
0.02 BSC
INCHES
0.021
0.009
0.005
0.062
0.047
0.008
0.062
NOM
NSR0320XV6T1/D
0.023
0.011
0.007
0.066
0.051
0.012
0.066
MAX

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