BAS116LT1G ON Semiconductor, BAS116LT1G Datasheet - Page 2

DIODE SWITCH 200MA 75V SOT23

BAS116LT1G

Manufacturer Part Number
BAS116LT1G
Description
DIODE SWITCH 200MA 75V SOT23
Manufacturer
ON Semiconductor
Datasheet

Specifications of BAS116LT1G

Voltage - Forward (vf) (max) @ If
1.25V @ 150mA
Voltage - Dc Reverse (vr) (max)
75V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
5nA @ 75V
Diode Type
Standard
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
3µs
Capacitance @ Vr, F
2pF @ 0V, 1MHz
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Product
Switching Diodes
Peak Reverse Voltage
75 V
Forward Continuous Current
0.2 A
Max Surge Current
0.5 A
Configuration
Single
Recovery Time
3000 ns
Forward Voltage Drop
1.1 V
Operating Temperature Range
- 55 C to + 150 C
Maximum Diode Capacitance
2 pF
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BAS116LT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAS116LT1G
Manufacturer:
ON Semiconductor
Quantity:
64 674
Part Number:
BAS116LT1G
Manufacturer:
ON
Quantity:
30 000
Part Number:
BAS116LT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Product Bulletin #16134
3.
Parts with a smooth bottom surface finish have been attributed with higher failure rates as compared to failure rates
of parts with a matte finish. A matte finish has more surface area for the glue to adhere to as compared to a part
with a smooth surface. As a containment action, ON Semiconductor has placed shipment holds on any inventories
of smooth parts and has notified some customers who have received smooth parts.
We also suspended manufacturing on mold systems that produce smooth parts to have those mold systems
enhanced to produce parts with a matte surface finish. These containment actions have temporarily affected our
capacity but have been resolved and we have returned to full capacity.
The enhanced matte surface is designed to overcome any variability of the mold compound and aids in a
containment action until we can eliminate that variability.
What to do next?
If you have consumed product starting from date code 0814 and have not experienced any component placement
issues on your boards, you should not be affected. Product reliability is not a concern as parts either solder
normally or they don’t.
If you have a manufacturing process that consists of gluing these components to the bottom side of a board in a
wave solder process and have experienced components falling off boards with a greater than normal frequency,
please contact your ON Semiconductor Customer Service Representative or Salesperson to facilitate product
replacement or contact a technical representative to further discuss the issue for containment or other actions.
For technical assistance, please contact:
Asia Pacific/Japan:
Stephen Ng
ON Semiconductor Quality
Phone: +852 26890209
Email:
United States:
Mark Wasilewski
ON Semiconductor Quality
Phone: 602-244-5114
Email:
Europe:
Herve Marchionini
ON Semiconductor Quality,
Phone: +49 89 930 808 36
Email:
Issue Date: 11 Jul 2008
Surface finish of parts
stephen.ng@onsemi.com
m.wasilewski@onsemi.com
herve.marchionini@onsemi.com
Rev.07-02-06
Page 2 of 14

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