BYV29B-500,118 NXP Semiconductors, BYV29B-500,118 Datasheet

DIODE RECT UFAST 500V D2PAK

BYV29B-500,118

Manufacturer Part Number
BYV29B-500,118
Description
DIODE RECT UFAST 500V D2PAK
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BYV29B-500,118

Package / Case
D²Pak, TO-263 (2 leads + tab)
Voltage - Forward (vf) (max) @ If
1.25V @ 8A
Voltage - Dc Reverse (vr) (max)
500V
Current - Average Rectified (io)
9A
Current - Reverse Leakage @ Vr
50µA @ 500V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
60ns
Mounting Type
Surface Mount
Product
Ultra Fast Recovery Rectifier
Configuration
Single
Reverse Voltage
500 V
Forward Voltage Drop
1.4 V at 20 A
Recovery Time
60 ns
Forward Continuous Current
9 A
Max Surge Current
110 A
Reverse Current Ir
50 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-3434-2
934056951118
BYV29B-500 /T3
Philips Semiconductors
FEATURES
• Low forward volt drop
• Fast switching
• Soft recovery characteristic
• High thermal cycling performance
• Low thermal resistance
GENERAL DESCRIPTION
Ultra-fast, epitaxial rectifier diodes
intended for use as output rectifiers
in high frequency switched mode
power supplies.
The BYV29B-500 is supplied in the
SOT404
package.
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
THERMAL RESISTANCES
1 it is not possible to make a connection to pin 2 of the SOT404 package
2 Neglecting switching and reverse current losses.
September 2001
Rectifier diodes
ultrafast
SYMBOL PARAMETER
V
V
V
I
I
I
T
T
SYMBOL PARAMETER
R
R
F(AV)
FRM
FSM
stg
j
RRM
RWM
R
th j-mb
th j-a
surface
Peak repetitive reverse voltage
Crest working reverse voltage
Continuous reverse voltage
Average forward current
Repetitive peak forward current t = 25 s;
Non-repetitive peak forward
current.
Storage temperature
Operating junction temperature
Thermal resistance junction to
mounting base
Thermal resistance junction to
ambient
mounting
2
PINNING
SYMBOL
PIN
tab
1
2
3
1
k
CONDITIONS
square wave;
t = 10 ms
t = 8.3 ms
sinusoidal; with reapplied V
CONDITIONS
minimum footprint, FR4 board.
no connection
cathode
anode
cathode
DESCRIPTION
1
1
= 0.5; T
= 0.5; T
mb
a
2
mb
123 ˚C
RRM(max)
123 ˚C
QUICK REFERENCE DATA
SOT404 (D
MIN.
MIN.
-40
-
-
-
-
-
-
-
-
-
-
V
V
I
t
F(AV)
F
rr
R
TYP.
Product specification
2
50
-PAK)
= 500 V
1
-
1.03 V
60 ns
tab
BYV29B-500
MAX.
= 9 A
2
500
500
500
100
110
150
150
18
9
3
MAX.
2.5
-
Rev 1.000
UNIT
UNIT
K/W
K/W
˚C
˚C
V
V
V
A
A
A
A

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BYV29B-500,118 Summary of contents

Page 1

... Low thermal resistance GENERAL DESCRIPTION Ultra-fast, epitaxial rectifier diodes intended for use as output rectifiers in high frequency switched mode power supplies. The BYV29B-500 is supplied in the SOT404 surface mounting package. LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). ...

Page 2

... / time 5 100% 10 and I Fig.3. Maximum forward dissipation P s rrm time time Fig.4. Maximum forward dissipation Product specification BYV29B-500 MIN. TYP. - 0.90 - 1.05 - 1.20 - 2 4.0 = 100˚C - 2.5 BYV29 Vo = 0.8900 0.0190 Ohms 0.5 0.2 0 IF(AV square wave where I =I F(AV) F(RMS) ...

Page 3

... Fig.7. Typical and maximum forward characteristic 1000 100 10 1 100 1.0 Fig.8. Maximum Q Transient thermal impedance, Zth j-mb (K/ 0.1 0.01 0.001 1us 10us 100us Fig.9. Transient thermal impedance Z 3 Product specification BYV29B-500 BYW29 typ max 1 parameter 100 -dIF/dt (A/us 25˚ ...

Page 4

... Epoxy meets UL94 V0 at 1/8". September 2001 10.3 max 11 max 15.4 0.85 max (x2) Fig.10. SOT404 : centre pin connected to mounting base. 11.5 9.0 2.0 3.8 5.08 Fig.11. SOT404 : soldering pattern for surface mounting. 4 Product specification BYV29B-500 4.5 max 1.4 max 2.5 0.5 17.5 Rev 1.000 ...

Page 5

... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 5 Product specification BYV29B-500 Rev 1.000 ...

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