CPC1466D Clare, CPC1466D Datasheet - Page 14

• Manufacturer Part Number: CPC1466D
• Description: DC TERMINATION IC
• Manufacturer: Clare

Specifications of CPC1466D

• Operating Temperature (min): -40C
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Package Type: SOIC
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

CPC1466
3.2 Printed Circuit Board Layout Pattern
3.2.1 SOIC
3.3 Tape and Reel Packaging
3.3.1 SOIC
14
Tape and Reel Packaging for 16-Pin SOIC Package
(0.075)
1.90
Embossed
Carrier
(0.024)
0.60
(13.00 Dia)
330.2 Dia
Tape Thickness
(0.004 Max)
0.102 Max
Top Cover
Embossment
(0.366)
9.30
(0.050)
1.27
DIMENSIONS
Top Cover
(inches)
mm
K
K
(0.193 + 0.01)
(0.106 + 0.01)
Tape
0
1
=3.20 + 0.15
=2.70 + 0.15
www.clare.com
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
3.2.2 MLP
NOTE: As the metallic pad on the bottom of the MLP
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces or
vias be placed under this area.
(0.026)
P=12.00
(0.017)
0.65
(0.47)
0.43
(0.016)
0.40
User Direction of Feed
(0.045)
1.15
(0.045)
1.15
(0.016)
B
0.40
(0.421 + 0.01)
0
(0.031)
=10.70 + 0.15
0.80
A
(0.429 + 0.010)
0
=10.90 + 0.15
W=16.00 + 0.30
(0.630 + 0.010)
DIMENSIONS
Dimensions
(inches)
(inches)
mm
mm
(0.224)
5.70
R00B