XB4A-4035-D Omron, XB4A-4035-D Datasheet - Page 3

• Manufacturer Part Number: XB4A-4035-D
• Description: Board To FPC Connector
• Manufacturer: Omron
• Series: XB4Ar

Specifications of XB4A-4035-D

• Connector Type: Plug, Center Strip Contacts
• Number Of Positions: 40
• Pitch: 0.016" (0.40mm)
• Number Of Rows: 2
• Mounting Type: Surface Mount
• Contact Finish: Gold
• Contact Finish Thickness: 5.9µin (0.15µm)
• Mated Stacking Heights: 0.9mm
• Height Above Board: 0.030" (0.75mm)
• Product Type: PCB
• Number Of Positions / Contacts: 40
• Mounting Angle: Vertical
• Mounting Style: SMD/SMT
• Housing Material: Liquid Crystal Polymer
• Contact Material: Spring Copper Alloy / Nickel Substrate
• Contact Plating: Gold
• Voltage Rating: 50 V
• Current Rating: 0.3 A
• Termination Style: Solder
• Wire Type: FPC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: OR768TR; XB4A4035D

Safety Precautions
Precautions for Correct Use
For Operating
1. Regarding the connector stacking operation, it should be con-
2. Ensure that the connector stackings are fully seated.
3. Do not apply an extreme load when inserting or drawing out the
4. When stacking the plug and socket, press the back side of printed
5. When drawing out, hold the edge of the printed circuit board near
firmed there is no extreme displacement and tilt in the stacking
contact areas between a plug and a socket before the stacking
operation of the connectors.
• An incomplete stacking state may cause the failure of contact
connector.
• The connector may be damaged, resulting in faulty contacts.
circuit board mounted with them and then couple with as little
twisting force as possible.
• Doing so may cause the terminal and housing to change shape
the connector and remove as vertically as possible, as described
in the figure below.
• Drawing out the plug with too much force may have possibility to
reliability.
or the housing to crack.
change shape of terminal solder/housing crack.
Pitch direction
Row direction
0.4-mm Pitch Board to FPC Connector
6. Do not insert a foreign object such as a tweezers into the connec-
For Mounting
1. The reflow conditions are as stated in OMRON’s specifications
2. When mounting the connector by manual soldering, observe the
For Designing
1. When mounting the connector to the FPC, design the FPC so that
2. If the connector-mounted FPC is installed at a location or in any
3. Do not use plural connectors on same PCB.
4. When locating the connector on the printed circuit board, be sure
5. Ensure a metal mask thickness of t = 0.10 to 0.15 mm.
tor stacking contact area.
• Doing so may cause the plating peel off and deform the shape
and guidelines.
These conditions, however, depend on the type of solder, the
manufacturer, the amount of solder, the size of the circuit board,
and the other mounting materials.
following precautions to ensure contact reliability.
• Conditions for manual soldering: 350±10°C 3±1 sec
• Do not apply an excessive amount of solder. Excessive solder
• Do not apply the soldering iron to the mounting terminal. Doing
• Do not apply the soldering iron to any parts of the connector
extreme peel force should not be applied directly on to the con-
nector.
If the FPC bends near the connector, or if the FPC is used with
extreme peel force directly on to the connector, it may cause a
contact loss.
equipment that will subject the FPC to continuous shake or move-
ment, secure the FPC or take any countermeasure against FPC
disconnection from the connector.
• Doing so may cause solder and housing crack.
to allow space for the stacking operation.
The recommended open area of the metal mask is 90% of the
printed circuit board’s mating dimensions as shown in the dimen-
sional diagrams.
of the terminal.
will cause the flux creap.
so may cause the connectors to change shape.
other than the mount attachments. Doing so may cause the con-
nector to change shape.
XB4A/XB4B
39