IXGT20N120BD1 IXYS, IXGT20N120BD1 Datasheet

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IXGT20N120BD1

Manufacturer Part Number
IXGT20N120BD1
Description
IGBT 1200V FRD TO-268
Manufacturer
IXYS
Datasheet

Specifications of IXGT20N120BD1

Voltage - Collector Emitter Breakdown (max)
1200V
Vce(on) (max) @ Vge, Ic
3.4V @ 15V, 20A
Current - Collector (ic) (max)
40A
Power - Max
190W
Input Type
Standard
Mounting Type
Surface Mount
Package / Case
TO-268
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Igbt Type
-
High Voltage IGBT with Diode
Symbol
BV
V
I
I
V
© 2003 IXYS All rights reserved
Symbol
V
V
V
V
I
I
I
SSOA
(RBSOA)
P
T
T
T
M
Maximum lead temperature for soldering
1.6 mm (0.062 in.) from case for 10 s
Maximum tab temperature
soldering SMD devices for 10s
Weight
Preliminary Data Sheet
GES
CM
CES
C25
C110
JM
GE(th)
CE(sat)
GEM
J
stg
CES
CGR
GES
C
d
CES
Test Conditions
I
I
V
V
V
I
Note 2
Test Conditions
T
T
Continuous
Transient
T
T
T
V
Clamped inductive load
T
Mounting torque
C
C
C
GE
C
C
C
C
CE
CE
J
J
GE
= 25°C to 150°C
= 25°C to 150°C; R
= 25°C
= 110°C
= 25°C, 1 ms
= 15 V, T
= 25°C
= 1 µA, V
= 250 µA, V
= V
= 0 V
= 0 V, V
= 20A
CES
,
V
GE
J
GE
GE
= 125°C, R
= ±20 V
= 0 V
= 15 V
CE
= V
(TO-247)
GE
GE
G
= 1 MΩ
= 10 Ω
T
T
T
(T
TO-247AD/TO-268
J
J
J
=125°C
J
= 25°C
= 125°C
= 25°C, unless otherwise specified)
IXGH 20N120BD1
IXGT 20N120BD1
1200
min.
2.5
Characteristic Values
-55 ... +150
-55 ... +150
@0.8 V
Maximum Ratings
typ.
1.13/10 Nm/lb.in.
I
2.9
2.8
50
CM
1200
1200
= 80
±20
±30
100
190
150
300
260
6/4
40
20
CES
max.
±100
150
5.0
3.4
µA
µA
nA
°C
°C
°C
°C
°C
W
V
V
V
V
V
V
V
V
A
A
A
A
g
Features
Advantages
V
I
V
t
TO-268
(IXGT)
G = Gate
E = Emitter
TO-247AD
(IXGH)
C25
fi(typ)
International standard packages:
JEDEC TO-247AD & TO-268
IGBT and anti-parallel FRED for
resonant power supplies
- Induction heating
- Rice cookers
MOS Gate turn-on
- drive simplicity
Fast Recovery Expitaxial Diode (FRED)
- soft recovery with low I
Saves space (two devices in one
package)
Easy to mount with 1 screw
(isolated mounting screw hole)
Reduces assembly time and cost
CES
CE(sat)
G
C
E
G
= 1200 V
=
= 160 ns
= 3.4 V
C = Collector
TAB = Collector
E
40 A
DS98985E(07/03)
RM
C (TAB)
TAB

Related parts for IXGT20N120BD1

IXGT20N120BD1 Summary of contents

Page 1

... GE(th CES CE CES ± GES 20A CE(sat Note 2 © 2003 IXYS All rights reserved IXGH 20N120BD1 IXGT 20N120BD1 Maximum Ratings 1200 = 1 MΩ 1200 GE ±20 ± 100 = 10 Ω @0.8 V CES 190 -55 ... +150 150 -55 ... +150 (TO-247) 1.13/10 Nm/lb.in. 300 260 TO-247AD/TO-268 6/4 ...

Page 2

... T or increased R J Pulse test, t ≤ 300 µs, duty cycle d ≤ IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: Characteristic Values (T = 25°C, unless otherwise specified) J min ...

Page 3

... V - Volts CE Fig. 3. Output Characteristics @ 125 Deg 0 2 Volts CE Fig. 5. Input Admittance -40º 25ºC 1 25º Volts GE © 2003 IXYS All rights reserved 3 3 IXGH 20N120BD1 IXGT 20N120BD1 Fig. 2. Extended Output Characteristics @ 25 deg Volts CE Fig. 4. Temperature Dependence 40A C 1 ...

Page 4

... Fig. 11. Reverse-Bias Safe Operating Area 90 80 º 125 Ohms G 60 dV/dT < 10V/ 300 500 700 V - Volts CE IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents off 40A 20A Temperature off I = 40A 20A C I ...

Page 5

... 120 °C 160 T VJ Fig. 16. Dynamic parameters versus K/W 0.1 Z thJC 0.01 0.001 0.00001 0.0001 0.001 Fig. 19. Transient thermal resistance junction to case © 2003 IXYS All rights reserved 100°C VJ µ 600V 60A 30A 15A 100 A/µs -di /dt F Fig. 14. Reverse recovery charge Q ...

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