NTLJD3115PT1G ON Semiconductor, NTLJD3115PT1G Datasheet

MOSFET P-CHAN DUAL 20V 6-WDFN

NTLJD3115PT1G

Manufacturer Part Number
NTLJD3115PT1G
Description
MOSFET P-CHAN DUAL 20V 6-WDFN
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheet

Specifications of NTLJD3115PT1G

Fet Type
2 P-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
100 mOhm @ 2A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
2.3A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
6.2nC @ 4.5V
Input Capacitance (ciss) @ Vds
531pF @ 10V
Power - Max
710mW
Mounting Type
Surface Mount
Package / Case
6-VDFN Exposed Pad
Number Of Elements
2
Polarity
P
Channel Mode
Enhancement
Drain-source On-res
0.1Ohm
Drain-source On-volt
20V
Gate-source Voltage (max)
±8V
Continuous Drain Current
3.3A
Power Dissipation
1.5W
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
6
Package Type
WDFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTLJD3115PT1G
NTLJD3115PT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTLJD3115PT1G
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
NTLJD3115PT1G
Quantity:
300
NTLJD3115P
Power MOSFET
−20 V, −4.1 A, mCoolt Dual P−Channel,
2x2 mm WDFN Package
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
2. Surface Mounted on FR4 Board using the minimum recommended pad size
© Semiconductor Components Industries, LLC, 2009
July, 2009 − Rev. 5
MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Pulsed Drain Current
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
Conduction
Level
Portable Equipment
WDFN Package Provides Exposed Drain Pad for Excellent Thermal
2x2 mm Footprint Same as SC−88
Lowest R
1.8 V R
Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
Bidirectional Current Flow with Common Source Configuration
This is a Pb−Free Device
Optimized for Battery and Load Management Applications in
Li−Ion Battery Charging and Protection Circuits
High Side Load Switch
[2 oz] including traces).
of 30 mm
DS(on)
2
DS(on)
, 2 oz Cu.
Parameter
Rating for Operation at Low Voltage Gate Drive Logic
Solution in 2x2 mm Package
(T
Steady
Steady
Steady
t ≤ 5 s
t ≤ 5 s
State
State
State
J
= 25°C unless otherwise noted)
t
p
= 10 ms
T
T
T
T
T
T
T
A
A
A
A
A
A
A
= 25°C
= 85°C
= 25°C
= 25°C
= 25°C
= 85°C
= 25°C
T
Symbol
J
V
V
, T
I
P
P
T
DSS
DM
I
I
I
GS
D
D
S
D
D
L
STG
−55 to
Value
±8.0
−3.3
−2.4
−4.1
−2.3
−1.6
0.71
−1.9
−20
−20
150
260
1.5
2.3
1
Unit
°C
°C
W
W
V
V
A
A
A
A
†For information on tape and reel specifications,
NTLJD3115PT1G
NTLJD3115PTAG
Pin 1
G1
V
P−CHANNEL MOSFET
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
D2
(BR)DSS
−20 V
Device
G1
D2
S1
ORDERING INFORMATION
JD = Specific Device Code
M
G
(Note: Microdot may be in either location)
D1
S1
1
2
3
100 mW @ −4.5 V
135 mW @ −2.5 V
200 mW @ −1.8 V
PIN CONNECTIONS
http://onsemi.com
= Date Code
= Pb−Free Package
R
D1
DS(on)
CASE 506AN
D2
(Top View)
(Pb−Free)
(Pb−Free)
Package
WDFN6
WDFN6
WDFN6
MAX
Publication Order Number:
P−CHANNEL MOSFET
G2
D1
3000/Tape & Reel
3000/Tape & Reel
I
D
NTLJD3115P/D
MARKING
DIAGRAM
1
2
3
Shipping
MAX (Note 1)
6
5
4
D2
S2
−4.1 A
JDMG
D1
G2
S2
G
6
5
4

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NTLJD3115PT1G Summary of contents

Page 1

... −55 to °C J STG 150 I −1 260 °C L NTLJD3115PT1G NTLJD3115PTAG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 http://onsemi.com R MAX I MAX (Note 1) DS(on) D 100 mW @ −4.5 V −4.1 A 135 mW @ −2.5 V 200 mW @ − ...

Page 2

THERMAL RESISTANCE RATINGS Parameter SINGLE OPERATION (SELF−HEATED) Junction−to−Ambient – Steady State (Note 3) Junction−to−Ambient – Steady State Min Pad (Note 4) Junction−to−Ambient – t ≤ (Note 3) DUAL OPERATION (EQUALLY HEATED) Junction−to−Ambient – Steady State (Note 3) Junction−to−Ambient ...

Page 3

MOSFET ELECTRICAL CHARACTERISTICS Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage V Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 5) Gate Threshold Voltage Negative Gate Threshold V Temperature Coefficient Drain−to−Source On−Resistance Forward Transconductance ...

Page 4

TYPICAL PERFORMANCE CURVES −1 − 4.5 4 3.5 3 2.5 2 1 0.5 1 1.5 2 2.5 −V , DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0.1 V ...

Page 5

TYPICAL PERFORMANCE CURVES 1200 1000 C iss 800 600 400 C rss C 200 oss GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure ...

Page 6

TYPICAL PERFORMANCE CURVES 1000 D = 0.5 100 0.2 0.1 10 0.05 0.02 0.01 1 SINGLE PULSE 0.1 0.000001 0.00001 0.0001 (T = 25°C unless otherwise noted (pk DUTY CYCLE 0.001 ...

Page 7

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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