TJA1054T/N1M,512 NXP Semiconductors, TJA1054T/N1M,512 Datasheet
TJA1054T/N1M,512
Specifications of TJA1054T/N1M,512
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TJA1054T/N1M,512 Summary of contents
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TJA1054 Fault-tolerant CAN transceiver Rev. 4 — 3 August 2010 1. General description The TJA1054 is the interface between the protocol controller and the physical bus wires in a Controller Area Network (CAN primarily intended for low-speed applications ...
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... NXP Semiconductors 2.3 Protections Bus pins short-circuit safe to battery and to ground Thermally protected Bus lines protected against transients in an automotive environment An unpowered node does not disturb the bus lines 2.4 Support for low power modes Low current sleep mode and standby mode with wake-up via the bus lines Power-on reset flag on the output 3 ...
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... NXP Semiconductors [4] Junction temperature in accordance with “IEC 60747-1”. An alternative definition is: T where R combinations of power dissipation (P) and ambient temperature (T 4. Ordering information Table 2. Ordering information Type number Package Name TJA1054T SO14 TJA1054T/S900 SO14 TJA1054U - 5. Block diagram 1 INH 7 WAKE 5 STB TXD TIMER ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration 6.2 Pin description Table 3. Symbol INH TXD RXD ERR STB EN WAKE RTH RTL V CC CANH CANL GND BAT TJA1054 Product data sheet 1 INH TXD 2 3 RXD TJA1054T ERR 4 5 STB EN 6 WAKE ...
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... NXP Semiconductors 7. Functional description The TJA1054 is the interface between the CAN protocol controller and the physical wires of the CAN bus (see 125 kBd, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. ...
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... NXP Semiconductors Table 4. Failure weak termination implies a pull-down current source behavior of 75 μA typical. [1] A weak termination implies a pull-up current source behavior of 75 μA typical. [2] Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure 6, the reception is switched to the single-wire mode through CANH ...
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... NXP Semiconductors 7.2 Low power modes The transceiver provides three low power modes which can be entered and exited via STB and EN (see The sleep mode is the mode with the lowest power consumption. Pin INH is switched to HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL ...
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... NXP Semiconductors A local wake-up through pin WAKE is detected by a rising or falling edge with a consecutive level exceeding the maximum specified wake-up request the transceiver will set the output on pin INH to HIGH which can be used to activate the external supply voltage regulator provided the wake-up request can be read on the ERR or RXD outputs, so the ...
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... NXP Semiconductors (1) Mode change via input pins STB and EN. (2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is (3) Pin INH is activated after wake-up via bus input pin WAKE. (4) Transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are (5) Transitions to sleep mode: pin INH is deactivated ...
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... NXP Semiconductors Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V I(WAKE) I I(WAKE) V INH V RTH V RTL R RTH R RTL stg V ESD [1] All voltages are defined with respect to pin GND, unless otherwise specified. Positive current flows into the device. [2] Only relevant if V [3] Junction temperature in accordance with “ ...
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... NXP Semiconductors 10. Static characteristics Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter Supplies (pins V and BAT supply voltage CC V supply voltage for forced CC(stb) standby mode (fail-safe) I supply current CC V battery supply voltage ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter Pins RXD and ERR V HIGH-level output OH) voltage on pin ERR on pin RXD V LOW-level output OL voltage on pin ERR on pin RXD Pin WAKE I LOW-level input current V ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter I output current on O(CANL) pin CANL V detection voltage for d(CANH)(sc) short-circuit to battery voltage on pin CANH V detection voltage for d(CANL)(sc) short-circuit to battery voltage on pin CANL ...
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... NXP Semiconductors Table 8. Static characteristics BAT ground; positive currents flow into the device; unless otherwise specified. Symbol Parameter I pull-down current on pd(RTH) pin RTH Thermal shutdown T shutdown junction j(sd) temperature [1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at T ...
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... NXP Semiconductors Table 9. Dynamic characteristics BAT ground; unless otherwise specified. Symbol Parameter t disable time of TxD dis(TxD) permanent dominant timer t dominant time for remote CANH wake-up on pin CANH t dominant time for remote CANL wake-up on pin CANL t required time on pin WAKE ...
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... NXP Semiconductors V V CANL V CANH Δ V CAN V RXD Fig 4. Timing diagram for dynamic characteristics 12. Test information Fig 5. Test circuit for dynamic characteristics TJA1054 Product data sheet TXD t PD(L) − diff CANH CANL + 5 V INH 1 WAKE 7 TXD 2 STB RXD Termination resistors R1 (100 Ω) are not connected to pin RTH or pin RTL for testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω ...
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... NXP Semiconductors + 5 V Fig 6. Test circuit for automotive transients WAKE Fig 7. Application diagram 12.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1054 Product data sheet + μF ...
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... NXP Semiconductors 13. Bare die information Table 10. Symbol INH TXD RXD ERR STB EN WAKE RTH RTL V CC CANH CANL GND GND BAT [1] All coordinates (μm) represent the position of the center of each pad with respect to the bottom left-hand corner of the top aluminium layer (see Fig 8 ...
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... NXP Semiconductors 14. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 15. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... Release date TJA1054 v.4 20100803 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Value of parameter V • Typing error corrected in ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post-packing tests performed on individual die or wafers. NXP Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, NXP Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 Optimized for in-car low-speed communication . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Bus failure management 2.3 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 Support for low power modes . . . . . . . . . . . . . . 2 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning ...