IRF6619 International Rectifier, IRF6619 Datasheet - Page 3
IRF6619
Manufacturer Part Number
IRF6619
Description
MOSFET N-CH 20V 30A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet
1.IRF6619.pdf
(10 pages)
Specifications of IRF6619
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.2 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
2.45V @ 250µA
Gate Charge (qg) @ Vgs
57nC @ 4.5V
Input Capacitance (ciss) @ Vds
5040pF @ 10V
Power - Max
2.8W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MX
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
IRF6619TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IRF6619
Manufacturer:
IR
Quantity:
14 000
Company:
Part Number:
IRF6619TR1PBF
Manufacturer:
IR
Quantity:
654
Part Number:
IRF6619TR1PBF
Manufacturer:
IR
Quantity:
20 000
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
0.0001
0.001
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.02
0.05
0.01
0.10
0.20
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
0.0001
kl
k
il
jl
l
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
1
Ci
0.01
i/Ri
T
R
R
1
C
θ
R
1
is measured at
measured with thermocouple incontact with top (Drain) of part.
τ
2
R
τ
2
2
R
2
0.1
R
τ
3
3
R
τ
3
3
J
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
Typ.
12.5
–––
–––
1.0
20
τ
R
4
τ
4
R
4
1
4
τ
-40 to + 150
τ
C
τ
Ri (°C/W)
Max.
0.017
0.6784
17.299
17.566
9.4701
270
footprint full size board with
metalized back and with small
clip heatsink (still air)
2.8
1.8
89
Mounted on minimum
10
Max.
106
–––
–––
–––
1.4
0.00086
0.57756
45
8.94
τi (sec)
100
Units
Units
°C/W
W/°C
°C
W
3