IRF6619 International Rectifier, IRF6619 Datasheet - Page 3

MOSFET N-CH 20V 30A DIRECTFET

IRF6619

Manufacturer Part Number
IRF6619
Description
MOSFET N-CH 20V 30A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6619

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.2 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
2.45V @ 250µA
Gate Charge (qg) @ Vgs
57nC @ 4.5V
Input Capacitance (ciss) @ Vds
5040pF @ 10V
Power - Max
2.8W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric MX
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
IRF6619TR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF6619
Manufacturer:
IR
Quantity:
14 000
Part Number:
IRF6619TR1PBF
Manufacturer:
IR
Quantity:
654
Part Number:
IRF6619TR1PBF
Manufacturer:
IR
Quantity:
20 000
ˆ
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
† Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
@T
@T
@T
A
A
C
0.0001
0.001
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.02
0.05
0.01
0.10
0.20
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
0.0001
kl
k
il
jl
l
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
1
Ci
0.01
Š
i/Ri
T
R
R
1
C
θ
R
1
is measured at
measured with thermocouple incontact with top (Drain) of part.
τ
2
R
τ
2
2
R
2
0.1
R
τ
3
3
R
τ
3
3
J
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
Typ.
12.5
–––
–––
1.0
20
τ
R
4
τ
4
R
4
1
4
τ
-40 to + 150
τ
C
τ
Ri (°C/W)
Max.
0.017
0.6784
17.299
17.566
9.4701
270
footprint full size board with
metalized back and with small
clip heatsink (still air)
2.8
1.8
89
ˆ Mounted on minimum
10
Max.
106
–––
–––
–––
1.4
0.00086
0.57756
45
8.94
τi (sec)
100
Units
Units
°C/W
W/°C
°C
W
3

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