IRF5305PBF International Rectifier, IRF5305PBF Datasheet

MOSFET P-CH 55V 31A TO-220AB

IRF5305PBF

Manufacturer Part Number
IRF5305PBF
Description
MOSFET P-CH 55V 31A TO-220AB
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRF5305PBF

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
60 mOhm @ 16A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
31A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
63nC @ 10V
Input Capacitance (ciss) @ Vds
1200pF @ 25V
Power - Max
110W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Current, Drain
-31 A
Gate Charge, Total
63 nC
Package Type
TO-220AB
Polarization
P-Channel
Power Dissipation
110 W
Resistance, Drain To Source On
0.06 Ohm
Temperature, Operating, Maximum
+175 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
39 ns
Time, Turn-on Delay
14 ns
Transconductance, Forward
8 S
Voltage, Breakdown, Drain To Source
-55 V
Voltage, Forward, Diode
-1.3 V
Voltage, Gate To Source
±20 V
Transistor Polarity
P-Channel
Drain-source Breakdown Voltage
- 55 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
- 31 A
Mounting Style
Through Hole
Gate Charge Qg
42 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRF5305PBF

Available stocks

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Price
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Quantity:
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Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
D
D
DM
AR
J
STG
D
GS
AS
AR
θJC
θCS
θJA
@ T
@ T
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
P-Channel
Fully Avalanche Rated
Lead-Free
@T
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ -10V
@ -10V
G
Typ.
300 (1.6mm from case )
0.50
–––
–––
S
D
HEXFET
10 lbf•in (1.1N•m)
IRF5305PbF
-55 to + 175
Max.
-110
0.71
-5.0
110
± 20
280
-31
-22
-16
11
TO-220AB
®
R
DS(on)
V
Power MOSFET
Max.
DSS
I
–––
1.4
D
62
= -31A
= -55V
= 0.06Ω
PD - 94788
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
10/31/03

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IRF5305PBF Summary of contents

Page 1

... T Storage Temperature Range STG Soldering Temperature, for 10 seconds Mounting torque, 6- srew Thermal Resistance Parameter R Junction-to-Case θJC R Case-to-Sink, Flat, Greased Surface θCS R Junction-to-Ambient θJA IRF5305PbF HEXFET Max. @ -10V GS @ -10V GS -110 0.71 -5.0 - 175 300 (1.6mm from case ) 10 lbf•in (1.1N•m) Typ. ...

Page 2

... IRF5305PbF Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... Fig 3. Typical Transfer Characteristics www.irf.com 1000 TOP BOTTOM - 4.5V 100 100 0.1 Fig 2. Typical Output Characteristics 2 1.5 1.0 0.5 = -25V 0 -60 -40 -20 Fig 4. Normalized On-Resistance IRF5305PbF VGS - 15V - 10V - 8.0V - 7.0V - 6.0V - 5.5V - 5.0V -4.5V 20µs PULSE WIDTH T = 175° Drain-to-Source Voltage ( -27A V = -10V 100 120 140 160 180 T , Junction Temperature (° ...

Page 4

... IRF5305PbF 2500 1MHz iss rss oss ds gd 2000 C iss C oss 1500 1000 C rss 500 Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 1000 100 T = 175° 25° 0.4 0.8 1 Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage -16A D SHORTED ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com R Pulse Width ≤ 1 µs Duty Factor ≤ 0.1 % Fig 10a. Switching Time Test Circuit V GS 10% 125 150 175 ° 90 Fig 10b. Switching Time Waveforms 0.001 t , Rectangular Pulse Duration (sec) 1 IRF5305PbF D.U. -10V d(on) r ...

Page 6

... IRF5305PbF D.U DRIVER -20V 0.01 Ω Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Q G -10V Charge Fig 13a. Basic Gate Charge Waveform 6 700 - V DD 600 + A 500 400 300 15V 200 100 Starting T , Junction Temperature (°C) Fig 12c. Maximum Avalanche Energy ...

Page 7

... Duty Factor "D" SD • D.U.T. - Device Under Test Period D = P.W. Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple ≤ 5.0V for Logic Level and 3V Drive Devices GS Fig 14. For P-Channel HEXFETS IRF5305PbF + + P.W. Period [ ] *** V =10V ...

Page 8

... IRF5305PbF TO-220AB Package Outline Dimensions are shown in millimeters (inches) 10.54 (.415) 10.29 (.405) 2.87 (.113) 2.62 (.103) 4 15.24 (.600) 14.84 (.584 14.09 (.555) 13.47 (.530) 1.40 (.055) 3X 1.15 (.045) 2.54 (.100) 2X NOTES: 1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION : INCH ...

Page 9

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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