MTB30P06VT4G ON Semiconductor, MTB30P06VT4G Datasheet

MOSFET P-CH 60V 30A D2PAK

MTB30P06VT4G

Manufacturer Part Number
MTB30P06VT4G
Description
MOSFET P-CH 60V 30A D2PAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of MTB30P06VT4G

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
80 mOhm @ 15A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
30A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
80nC @ 10V
Input Capacitance (ciss) @ Vds
2190pF @ 25V
Power - Max
3W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.08 Ohms
Forward Transconductance Gfs (max / Min)
7.9 S
Drain-source Breakdown Voltage
- 60 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
30 A
Power Dissipation
3 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MTB30P06VT4GOS
MTB30P06VT4GOS
MTB30P06VT4GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MTB30P06VT4G
Manufacturer:
ON
Quantity:
15 000
Part Number:
MTB30P06VT4G
Manufacturer:
ON
Quantity:
12 500
Part Number:
MTB30P06VT4G
Manufacturer:
ON/安森美
Quantity:
20 000
MTB30P06V
Power MOSFET
30 Amps, 60 Volts
P−Channel D
avalanche and commutation modes. Designed for low voltage, high
speed switching applications in power supplies, converters and power
motor controls, these devices are particularly well suited for bridge
circuits where diode speed and commutating safe operating areas are
critical and offer additional safety margin against unexpected voltage
transients.
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using the minimum recommended
© Semiconductor Components Industries, LLC, 2006
July, 2006 − Rev.4
MAXIMUM RATINGS
Drain−to−Source Voltage
Drain−to−Gate Voltage (R
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t
Drain Current − Continuous @ 25°C
− Continuous @ 100°C
− Single Pulse (t
Total Power Dissipation @ 25°C
Derate above 25°C
Total Power Dissipation @ T
(Note 1)
Operating and Storage Temperature Range
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
(V
I
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient
− Junction−to−Ambient (Note 1)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 seconds
L
This Power MOSFET is designed to withstand high energy in the
Avalanche Energy Specified
I
Pb−Free Packages are Available
pad size.
DD
= 30 Apk, L = 1.0 mH, R
DSS
= 25 Vdc, V
and V
DS(on)
p
GS
Rating
≤ 10 ms)
p
J
≤ 10 ms)
= 10 Vdc, Peak
= 25°C
Specified at Elevated Temperature
2
PAK
(T
GS
C
G
A
= 25°C unless otherwise noted)
= 25 W)
= 1.0 MW)
Preferred Device
= 25°C
Symbol
T
V
V
V
R
R
R
J
V
E
I
GSM
P
DGR
, T
T
DSS
I
I
DM
qJC
qJA
qJA
GS
D
D
AS
D
L
stg
−55 to
Value
± 15
± 25
0.83
62.5
105
125
175
450
260
3.0
1.2
60
60
30
19
50
1
W/°C
°C/W
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
mJ
°C
°C
W
†For information on tape and reel specifications,
Preferred devices are recommended choices for future use
and best overall value.
MTB30P06V
MTB30P06VG
MTB30P06VT4
MTB30P06VT4G
MARKING DIAGRAM & PIN ASSIGNMENT
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Device
30 AMPERES, 60 VOLTS
1
ORDERING INFORMATION
A
Y
WW = Work Week
G
G
R
http://onsemi.com
Gate
DS(on)
= Assembly Location
= Year
= Pb−Free Package
1
P−Channel
(Pb−Free)
(Pb−Free)
Package
MTB
30P06VG
AYWW
D
D
D
D
4 Drain
D
Drain
2
2
2
2
PAK
PAK
PAK
PAK
Publication Order Number:
= 80 mW
2
S
CASE 418B
3
Source
STYLE 2
D
800/Tape & Reel
800/Tape & Reel
2
50 Units/Rail
50 Units/Rail
PAK
MTB30P06V/D
Shipping

Related parts for MTB30P06VT4G

MTB30P06VT4G Summary of contents

Page 1

... MTB30P06VG °C T 260 L MTB30P06VT4 MTB30P06VT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Preferred devices are recommended choices for future use and best overall value. 1 http://onsemi.com ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−Source Breakdown Voltage ( Vdc 0.25 mAdc Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( Vdc Vdc Vdc, ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS 25° 10V DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0. ...

Page 4

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Dt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 5

TOTAL GATE CHARGE (nC) g Figure 8. Gate−To−Source and Drain−To−Source Voltage versus Total Charge DRAIN−TO−SOURCE DIODE CHARACTERISTICS ...

Page 6

LIMIT GS DS(on) SINGLE PULSE THERMAL LIMIT T = 25°C PACKAGE LIMIT C 100 100 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 11. Maximum ...

Page 7

... PL 0.13 (0.005 VARIABLE CONFIGURATION ZONE VIEW W−W VIEW W−W 1 10.66 0.42 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MTB30P06V PACKAGE DIMENSIONS 2 D PAK 3 CASE 418B−04 ISSUE ...

Page 8

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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