IRLL3303 International Rectifier, IRLL3303 Datasheet

MOSFET N-CH 30V 4.6A SOT223

IRLL3303

Manufacturer Part Number
IRLL3303
Description
MOSFET N-CH 30V 4.6A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRLL3303

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
31 mOhm @ 4.6A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
4.6A
Vgs(th) (max) @ Id
1V @ 250µA
Gate Charge (qg) @ Vgs
50nC @ 10V
Input Capacitance (ciss) @ Vds
840pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRLL3303

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRLL3303
Manufacturer:
IR
Quantity:
20 000
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IRLL3303PBF
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NSC
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Part Number:
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Absolute Maximum Ratings
Thermal Resistance
Description
* When mounted on FR-4 board using minimum recommended footprint.
** When mounted on 1 inch square copper board, for comparison with other SMD devices.
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The SOT-223 package is designed for surface-mount
using vapor phase, infra red, or wave soldering techniques.
Its unique package design allows for easy automatic pick-
and-place as with other SOT or SOIC packages but has
the added advantage of improved thermal performance
due to an enlarged tab for heatsinking. Power dissipation
of 1.0W is possible in a typical surface mount application.
I
I
I
I
P
P
V
E
I
E
dv/dt
T
R
R
www.irf.com
D
D
D
DM
AR
J,
D
D
GS
AS
AR
@ T
@ T
@ T
JA
JA
Surface Mount
Dynamic dv/dt Rating
Logic-Level Gate Drive
Fast Switching
Ease of Paralleling
Advanced Process Technology
Ultra Low On-Resistance
@T
@T
T
STG
A
A
A
A
A
= 25°C
= 25°C
= 70°C
= 25°C
= 25°C
on-resistance per silicon area.
Continuous Drain Current, V
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation (PCB Mount)**
Power Dissipation (PCB Mount)*
Linear Derating Factor (PCB Mount)*
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Junction and Storage Temperature Range
Junction-to-Amb. (PCB Mount, steady state)*
Junction-to-Amb. (PCB Mount, steady state)**
Parameter
Parameter
GS
GS
GS
@ 10V**
@ 10V*
@ 10V*
This
G
Typ.
93
48
HEXFET
S
-55 to + 150
D
S O T -22 3
Max.
0.10
± 16
140
6.5
4.6
3.7
1.0
8.3
1.3
2.1
4.6
37
IRLL3303
®
R
Max.
Power MOSFET
DS(on)
120
60
V
I
DSS
D
= 4.6A
PD- 91379C
= 0.031
= 30V
mW/°C
Units
Units
°C/W
V/ns
mJ
mJ
°C
W
W
A
V
A
1
1/22/99

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IRLL3303 Summary of contents

Page 1

... When mounted on FR-4 board using minimum recommended footprint. ** When mounted on 1 inch square copper board, for comparison with other SMD devices. www.irf.com HEXFET This - 10V 10V 10V 150 Typ PD- 91379C IRLL3303 ® Power MOSFET V = 30V DSS R = 0.031 DS(on 4.6A D Max. Units 6.5 4.6 A 3 ...

Page 2

... IRLL3303 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... Fig 3. Typical Transfer Characteristics www.irf.com TOP BOTTOM 3. . 0.1 Fig 2. Typical Output Characteristics 2 .6A D 1.5 1.0 0 0.0 A -60 -40 5.0 5.5 Fig 4. Normalized On-Resistance IRLL3303 VGS 15V 10V 7.0V 5.5V 4.5V 4.0V 3.5V 3 .0V 2 0µ 0° rain-to-S ource V oltage ( - Junction T em perature (° ...

Page 4

... IRLL3303 iss iss oss rss rain-to-S ourc e V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 0° 5° 0.4 0.6 0.8 1 ourc e-to-D rain V oltage ( Fig 7. Typical Source-Drain Diode Forward Voltage 4 Fig 6. Typical Gate Charge Vs ing lse 1.2 1.4 0.1 Fig 8. Maximum Safe Operating Area ...

Page 5

... Fig 9b. Gate Charge Test Circuit . Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient www.irf.com 10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit d(on) Fig 10b. Switching Time Waveforms 0 cta lse tio n ( IRLL3303 D.U. µ d(off fac ...

Page 6

... IRLL3303 . Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms tarting unc tion T em perature (° Fig 12c. Maximum Avalanche Energy 2 TTO Vs. Drain Current www.irf.com ...

Page 7

... Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test Period D = P.W. Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple for Logic Level Devices Fig 13. For N-Channel HEXFETS IRLL3303 + + P.W. Period V =10V * ...

Page 8

... IRLL3303 Package Outline SOT-223 (TO-261AA) Outline Part Marking Information SOT-223 TIO www.irf.com ...

Page 9

... IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936 http://www.irf.com/ www.irf.com (. (. (. (. (. (. (. (. (. (. 5.40 (. 1. CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel 451 0111 Data and specifications subject to change without notice. 1/99 IRLL3303 (. (. (. (. (. (. (. (. 0 (. ...

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