IRF710 Vishay, IRF710 Datasheet

MOSFET N-CH 400V 2A TO-220AB

IRF710

Manufacturer Part Number
IRF710
Description
MOSFET N-CH 400V 2A TO-220AB
Manufacturer
Vishay
Datasheet

Specifications of IRF710

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
3.6 Ohm @ 1.2A, 10V
Drain To Source Voltage (vdss)
400V
Current - Continuous Drain (id) @ 25° C
2A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
17nC @ 10V
Input Capacitance (ciss) @ Vds
170pF @ 25V
Power - Max
36W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
3.6 Ohms
Drain-source Breakdown Voltage
400 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
2 A
Power Dissipation
36 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Fall Time
11 ns
Minimum Operating Temperature
- 55 C
Rise Time
9.9 ns
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF710

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Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91041
S09-0070-Rev. A, 02-Feb-09
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Repetitive Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Mounting Torque
DS
DS(on)
g
gs
gd
SD
DD
(Max.) (nC)
(nC)
(nC)
(V)
≤ 2.0 A, dI/dt ≤ 40 A/µs, V
= 50 V, starting T
(Ω)
TO-220
a
J
G
= 25 °C, L = 52 mH, R
D
S
c
a
a
DD
b
V
≤ V
GS
For technical questions, contact: hvmos.techsupport@vishay.com
= 10 V
DS
G
, T
N-Channel MOSFET
J
Single
≤ 150 °C.
400
3.4
8.5
17
G
= 25 Ω, I
D
S
C
Power MOSFET
= 25 °C, unless otherwise noted
V
3.6
GS
AS
6-32 or M3 screw
at 10 V
= 2.0 A (see fig. 12).
T
for 10 s
C
= 25 °C
T
T
C
C
TO-220
IRF710PbF
SiHF710-E3
IRF710
SiHF710
= 100 °C
= 25 °C
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 W. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
SYMBOL
T
dV/dt
J
V
V
E
E
I
I
P
, T
device
I
DM
AR
DS
GS
AS
AR
D
D
stg
design,
- 55 to + 150
IRF710, SiHF710
LIMIT
300
± 20
0.29
400
120
2.0
1.2
6.0
2.0
3.6
4.0
1.1
36
10
low
Vishay Siliconix
d
on-resistance
www.vishay.com
lbf · in
UNIT
W/°C
N · m
V/ns
RoHS*
COMPLIANT
mJ
mJ
°C
W
V
A
A
Available
and
1

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IRF710 Summary of contents

Page 1

... IRF710PbF SiHF710-E3 IRF710 SiHF710 = 25 °C, unless otherwise noted ° 100 ° °C C for screw = 25 Ω 2.0 A (see fig. 12 ≤ 150 °C. J IRF710, SiHF710 Vishay Siliconix device design, low on-resistance SYMBOL LIMIT V 400 DS V ± 2 1.2 I 6.0 DM 0.29 E 120 AS I 2.0 ...

Page 2

... IRF710, SiHF710 Vishay Siliconix THERMAL RESISTANCE PARAMETER Maximum Junction-to-Ambient Case-to-Sink, Flat, Greased Surface Maximum Junction-to-Case (Drain) SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current Drain-Source On-State Resistance ...

Page 3

... V Drain-to-Source Voltage ( 91041_02 Fig Typical Output Characteristics, T Document Number: 91041 For technical questions, contact: hvmos.techsupport@vishay.com S09-0070-Rev. A, 02-Feb-09 4 °C C 91041_03 = 25 ° 150 °C C 91041_04 = 150 °C C IRF710, SiHF710 Vishay Siliconix ° 150 ° µs Pulse Width Gate-to-Source Voltage ( Fig Typical Transfer Characteristics 3 ...

Page 4

... IRF710, SiHF710 Vishay Siliconix 400 MHz iss rss 300 oss ds C iss 200 C oss 100 C rss Drain-to-Source Voltage ( 91041_05 Fig Typical Capacitance vs. Drain-to-Source Voltage 2 200 Total Gate Charge (nC) 91041_06 G Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com For technical questions, contact: hvmos.techsupport@vishay.com ...

Page 5

... For technical questions, contact: hvmos.techsupport@vishay.com S09-0070-Rev. A, 02-Feb-09 Fig. 10a - Switching Time Test Circuit 125 150 Fig. 10b - Switching Time Waveforms - 0 Rectangular Pulse Duration ( Fig. 12b - Unclamped Inductive Waveforms IRF710, SiHF710 Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0 d(on) r d(off) ...

Page 6

... IRF710, SiHF710 Vishay Siliconix 91041_12c Charge Fig. 13a - Basic Gate Charge Waveform www.vishay.com For technical questions, contact: hvmos.techsupport@vishay.com 6 300 Top 250 Bottom 200 150 100 100 Starting T , Junction Temperature (°C) J Fig. 12c - Maximum Avalanche Energy vs. Drain Current I D 0.89 A 1.3 A 2.0 A ...

Page 7

... SD • D.U.T. - device under test P.W. Period D = Period P.W. waveform SD Body diode forward current dI/dt waveform DS Diode recovery dV/dt Body diode forward drop Ripple ≤ for logic level and 3 V drive devices Fig For N-Channel IRF710, SiHF710 Vishay Siliconix + + www.vishay.com 7 ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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