IRFBE30S Vishay, IRFBE30S Datasheet

MOSFET N-CH 800V 4.1A D2PAK

IRFBE30S

Manufacturer Part Number
IRFBE30S
Description
MOSFET N-CH 800V 4.1A D2PAK
Manufacturer
Vishay
Datasheet

Specifications of IRFBE30S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
3 Ohm @ 2.5A, 10V
Drain To Source Voltage (vdss)
800V
Current - Continuous Drain (id) @ 25° C
4.1A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
78nC @ 10V
Input Capacitance (ciss) @ Vds
1300pF @ 25V
Power - Max
125W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRFBE30S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRFBE30S
Manufacturer:
IR
Quantity:
12 500
Part Number:
IRFBE30S
Manufacturer:
IR
Quantity:
20 000
Company:
Part Number:
IRFBE30SPBF
Quantity:
8 150
Company:
Part Number:
IRFBE30SPBF
Quantity:
70 000
Company:
Part Number:
IRFBE30STRLPBF
Quantity:
70 000
Note
a. See device orientation.
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. V
c. I
d. 1.6 mm from case.
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91119
S-81432-Rev. A, 07-Jul-08
PRODUCT SUMMARY
V
R
Q
Q
Q
Configuration
ORDERING INFORMATION
Package
Lead (Pb)-free
SnPb
ABSOLUTE MAXIMUM RATINGS T
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Linear Derating Factor
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Maximum Power Dissipation
Peak Diode Recovery dV/dt
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
Mounting Torque
(TO-262)
DS
DS(on)
g
gs
gd
SD
I
DD
2
(Max.) (nC)
PAK
(nC)
(nC)
(V)
≤ 4.1 A, dI/dt ≤ 100 A/µs, V
= 50 V, starting T
(Ω)
G
D
S
a
G
a
D
(TO-263)
J
D
= 25 °C, L = 29 mH, R
S
2
PAK
c
a
b
DD
V
GS
≤ 600 V, T
D
IRFBE30SPbF
SiHFBE30S-E3
IRFBE30S
SiHFBE30S
= 10 V
2
PAK (TO-263)
G
IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L
N-Channel MOSFET
Single
800
9.6
78
45
J
G
≤ 150 °C.
= 25 Ω, I
D
S
C
Power MOSFET
= 25 °C, unless otherwise noted
V
3.0
GS
AS
6-32 or M3 screw
at 10 V
= 4.1 A (see fig. 12).
T
for 10 s
C
= 25 °C
T
T
C
C
D
IRFBE30STRLPbF
SiHFBE30STL-E3
-
-
= 100 °C
= 25 °C
2
FEATURES
• Dynamic dV/dt Rating
• Repetitive Avalanche Rated
• Fast Switching
• Ease of Paralleling
• Simple Drive Requirements
• Lead (Pb)-free Available
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized
cost-effectiveness.
PAK (TO-263)
SYMBOL
T
dV/dt
J
V
V
E
E
I
I
P
, T
device
I
DM
AR
a
DS
GS
AS
AR
D
D
a
stg
design,
- 55 to + 150
I
IRFBE30LPbF
SiHFBE30L-E3
-
-
2
PAK (TO-262)
LIMIT
300
± 20
800
260
125
4.1
2.6
1.0
4.1
2.0
1.1
16
13
10
low
d
Vishay Siliconix
on-resistance
www.vishay.com
lbf · in
UNIT
W/°C
N · m
V/ns
RoHS*
mJ
mJ
COMPLIANT
°C
W
V
A
A
Available
and
1

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IRFBE30S Summary of contents

Page 1

... A, dI/dt ≤ 100 A/µs, V ≤ 600 1.6 mm from case containing terminations are not RoHS compliant, exemptions may apply Document Number: 91119 S-81432-Rev. A, 07-Jul-08 IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L Power MOSFET FEATURES • Dynamic dV/dt Rating 800 • Repetitive Avalanche Rated 3.0 78 • Fast Switching 9.6 • ...

Page 2

... IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER Maximum Junction-to-Ambient Case-to-Sink, Flat, Greased Surface Maximum Junction-to-Case (Drain) Note a. When mounted on 1" square PCB (FR-4 or G-10 material). SPECIFICATIONS °C, unless otherwise noted J PARAMETER Static Drain-Source Breakdown Voltage V Temperature Coefficient DS Gate-Source Threshold Voltage ...

Page 3

... TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted Fig Typical Output Characteristics, T Fig Typical Output Characteristics, T Document Number: 91119 S-81432-Rev. A, 07-Jul-08 IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L = 25 ° 150 °C Fig Normalized On-Resistance vs. Temperature C Vishay Siliconix Fig Typical Transfer Characteristics www.vishay.com 3 ...

Page 4

... IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L Vishay Siliconix Fig Typical Capacitance vs. Drain-to-Source Voltage Fig Typical Gate Charge vs. Gate-to-Source Voltage www.vishay.com 4 Fig Typical Source-Drain Diode Forward Voltage Fig Maximum Safe Operating Area Document Number: 91119 S-81432-Rev. A, 07-Jul-08 ...

Page 5

... Fig Maximum Effective Transient Thermal Impedance, Junction-to-Case Vary t to obtain p required I AS D.U. 0.01 Ω Fig. 12a - Unclamped Inductive Test Circuit Document Number: 91119 S-81432-Rev. A, 07-Jul-08 IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L + Vishay Siliconix D.U. Pulse width ≤ 1 µs Duty factor ≤ 0.1 % Fig ...

Page 6

... IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L Vishay Siliconix Fig. 12c - Maximum Avalanche Energy vs. Drain Current Charge Fig. 13a - Maximum Avalanche Energy vs. Drain Current www.vishay.com 6 Current regulator Same type as D.U.T. 50 kΩ 0.2 µF 0.3 µ D.U. Current sampling resistors Fig. 13b - Gate Charge Test Circuit Document Number: 91119 S-81432-Rev ...

Page 7

... Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?91119. Document Number: 91119 S-81432-Rev. A, 07-Jul-08 IRFBE30S, IRFBE30L, SiHFBE30S, SiHFBE30L Peak Diode Recovery dV/dt Test Circuit + Circuit layout considerations • ...

Page 8

... Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’ ...

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