NILMS4501NR2 ON Semiconductor, NILMS4501NR2 Datasheet

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NILMS4501NR2

Manufacturer Part Number
NILMS4501NR2
Description
IC MOSF N-CH 9.5A 24V ESD 4-LLP
Manufacturer
ON Semiconductor
Datasheet

Specifications of NILMS4501NR2

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Current Sensing
Rds On (max) @ Id, Vgs
13 mOhm @ 6A, 10V
Drain To Source Voltage (vdss)
24V
Current - Continuous Drain (id) @ 25° C
9.5A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
25nC @ 10V
Input Capacitance (ciss) @ Vds
1500pF @ 6V
Power - Max
1.4W
Mounting Type
Surface Mount
Package / Case
4-LLP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NILMS4501NR2
Quantity:
2 142
Part Number:
NILMS4501NR2G
Manufacturer:
ON/安森美
Quantity:
20 000
NILMS4501N
Power MOSFET with
Current Mirror FET
24 V, 9.5 A, N−Channel, ESD Protected,
1:250 Current Mirror, SO−8 Leadless
latest ON Semiconductor technology to achieve low figure of merit
while keeping a high accuracy in the linear region. This device takes
advantage of the latest leadless QFN package to improve thermal
transfer.
Features
Applications
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
May, 2006 − Rev. 4
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
N−Channel MOSFET with 1:250 current mirror device utilizing the
Current Sense MOSFET
"15% Current Mirror Accuracy
ESD Protected on the Main and the Mirror MOSFET
Low Gate Charge
Pb−Free Package is Available*
DC−DC Converters
Voltage Regulator Modules
Small DC Motor Controls
1
†For information on tape and reel specifications,
NILMS4501NR2
NILMS4501NR2G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Gate
V
24 V
Device
DSS
ORDERING INFORMATION
4501N = Device Code
A
Y
WW
G
N−Channel with Current
Drain (4)
PIN CONNECTIONS
http://onsemi.com
12 mW @ 4.5 V
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Bottom View)
CASE 508AA
R
Mirror FET
(Pb−Free)
DS(on)
Package
PLLP4
PLLP4
PLLP4
Sense
Publication Order Number:
Typ
Sense (1)
Source (2)
Gate (3)
2500/Tape & Reel
2500/Tape & Reel
NILMS4501N/D
MARKING
DIAGRAM
Shipping
AYWW
4501N
Source
I
Drain
D
9.5 A
Main
G
MAX

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NILMS4501NR2 Summary of contents

Page 1

... G = Pb−Free Package PIN CONNECTIONS Drain (4) (Bottom View) ORDERING INFORMATION Device Package NILMS4501NR2 PLLP4 NILMS4501NR2G PLLP4 (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 1 Typ I MAX D 9 ...

Page 2

MAIN MOSFET MAXIMUM RATINGS Rating Drain−to−Source Voltage Gate−to−Source Voltage Drain Current (Note 1) Continuous @ T = 25°C A Continuous @ T = 100°C A v10 s) Pulsed (t p Total Power Dissipation @ T = 25°C (Note 1) A ...

Page 3

MAIN MOSFET ELECTRICAL CHARACTERISTICS Characteristic DYNAMIC CHARACTERISTICS (Note 6) Input Capacitance Output Capacitance (V DS Transfer Capacitance SWITCHING CHARACTERISTICS (Note 6) Turn−On Delay Time Rise Time Turn−Off Delay Time Fall Time Turn−On Delay Time Rise Time Turn−Off Delay Time Fall ...

Page 4

TYPICAL ELECTRICAL CHARACTERISTICS 0.1 0.2 0.3 0.4 0.5 0 DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 20 V ...

Page 5

TYPICAL ELECTRICAL CHARACTERISTICS 2 2.0 1.5 1.0 0.5 0 −50 50 100 JUNCTION TEMPERATURE (°C) J Figure 7. On−Resistance Variation with Temperature 2000 T = −55°C I ...

Page 6

Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals (Dt) are determined by how fast the FET input capacitance can be charged by current from the ...

Page 7

... RR Compared to ON Semiconductor standard cell density low voltage MOSFETs, high cell density MOSFET diodes are faster (shorter t reverse recovery characteristic. The softness advantage of the high cell density diode means they can be forced through ...

Page 8

Figure 16. Diode Forward Voltage versus Current The Forward Biased Safe Operating Area curves define the maximum simultaneous drain−to−source voltage and drain current that a transistor can handle safely when it is forward ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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