RM TMK063 BJ102KP-F Taiyo Yuden, RM TMK063 BJ102KP-F Datasheet
RM TMK063 BJ102KP-F
Specifications of RM TMK063 BJ102KP-F
Related parts for RM TMK063 BJ102KP-F
RM TMK063 BJ102KP-F Summary of contents
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... Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, subma- rine system, military, etc ...
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... T e Paper tape Embossed tape － C 0.1±0.03 P 0.15±0.05 15000 C 20000 P 0.25±0.10 15000 V 10000 ●Low Profile Multilayer Ceramic Capacitors Type F/Y5V Cap ［pF］ VDC 6.3 〔3-digit〕 100 101 150 151 220 221 330 331 470 ...
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... We may provide X7R for some items according to the individual specification. *2 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels. ＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. ...
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... We may provide X7R for some items according to the individual specification. *2 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact Taiyo Yuden sales channels. ＊ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. ...
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REPRESENTATIVE PART NUMBERS ・0.3mm thickness （ P） Rated Part number 1 Part number 2 voltage 25V TMK105 BJ103□P TMK105 BJ104□P TMK105 BJ224□P 16V EMK105 BJ474□P 6.3V JMK105 BJ105□P ・0.2mm thickness （ C） Rated Part number 1 Part number 2 ...
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PACKAGING ①Minimum Quantity ◦Taped package Thickness Type mm □MK042 0.2 □MK063 0.3 0.3 □2K096 0.45 0.3 □WK105 0.5 0.2 □MK105 0.3 0.5 □VK105 0.5 0.45 □MK107 0.5 □WK107 0.8 0.5 □2K110 0.6 0.8 0.45 □MK212 0.85 □WK212 1.25 □4K212 ...
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... Tape Strength The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. ⑦Bulk Cassette Unit：mm The exchange of individual specification is necessary. Tape Thickness Please contact Taiyo Yuden sales channels 4.0max. 0.6max. 12±0.1 36＋0/−0 100mm or more Leader 400mm min ...
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... Thermal treatment （at 150℃ for 1hr） Note 2 None 1GHz 1ｋHz±10％ 0.5 to 5Vrms 1±0.2Vrms None Super Low Distortion Multilayer Ceramic Capacitors and Medium-High Voltage Multilayer Ceramic Capacitors are noted separately. 0.5pF≦C≦2pF：±0.1pF RH S△ C＞2pF：±5% T△ ...
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... Adhesive Strength of Terminal Electrodes Standard Temperature Compensating Specified （Class 1） High Frequency Type Value High Permittivity （Class 2） 【Test Methods and Remarks】 Multilayer Ceramic Capacitors Applied force Duration 042、063 Type 2N 30±5 sec. 105 Type or more 5N 12. Solderability ...
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RELIABILITY DATA 13. Resistance to Soldering Standard Temperature Compensating （Class 1） Specified High Frequency Type Value High Permittivity （Class 2） Note 1 【Test Methods and Remarks】 Class 1 042, 063 Type Preconditioning 150℃ min. Preheating Solder ...
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RELIABILITY DATA 16. Humidity Loading Standard Temperature Compensating （Class 1） Specified High Frequency Type Value High Permittivity （Class 2） Note 1 【Test Methods and Remarks】 Class 1 Standard Preconditioning None Temperature 40±2℃ Humidity 90 to 95％RH Duration 500＋24/ー0 hrs ...
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... Land-patterns） The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. （1） Recommended land dimensions for typical chip capacitors ●Multilayer Ceramic Capacitors : Recommended land dimensions （unit: mm） Wave-soldering Type 107 L 1 ...
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... PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 2. PCB Design ◆Pattern configurations （ Capacitor layout on PCBs） 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or de- flection. Items Not recommended Defl ...
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... Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. • Therefore, the soldering must be conducted with great care prevent malfunction of the components due to excessive thermal shock. • Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130℃. ...
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... Be careful not to subject capacitors to excessive mechanical shocks. （1） If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. （2） Please be careful that the mounted components do not come in contact with or bump against other boards or components. ...