08051C103KAT4A AVX Corporation, 08051C103KAT4A Datasheet - Page 5

• Manufacturer Part Number: 08051C103KAT4A
• Description: CAP 0.01UF 100VDC X7R 10% SMD 0805
• Manufacturer: AVX Corporation
• Type: Flatr

Specifications of 08051C103KAT4A

• Package/case: 0805
• Mounting: Surface Mount
• Capacitance Value: 0.01 uF
• Dielectric: X7R
• Voltage: 100 Vdc
• Product Length: 2.01 mm
• Product Height: 0.94(Max) mm
• Product Depth: 1.25 mm
• Tolerance: 10 %

High Voltage Chips
For 500V to 5000V Applications
DIMENSIONS
*Reflow Soldering Only
PART NUMBER (see page 2 for complete information and options)
SIZE
(L) Length
(W) Width
(T) Thickness
(t) terminal
Max.
1808
Style
1206
1210
1808
1812
1825
2220
2225
3640
AVX
max.
min.
W = 2500V
G = 2000V
C = 600V
A = 1000V
S = 1500V
H = 3000V
K = 5000V
7 = 500V
J = 4000V
Voltage
A
(0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)
(0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)
0.25 (0.010)
0.75 (0.030)
3.20 ± 0.2
1.60 ± 0.2
(0.060)
1206
1.52
Temperature
Coefficient
C = X7R
A = C0G
A
0.25 (0.010)
0.75 (0.030)
3.20 ± 0.2
2.50 ± 0.2
(0.067)
1210
220,000 pF = 224
1.70
22,000 pF = 223
1,000 pF = 102
(2 significant digits
+ no. of zeros)
Examples:
100 pF = 101
Capacitance
10 pF = 100
1 µF = 105
Code
271
0.25 (0.010)
1.02 (0.040)
4.57 ± 0.25
2.03 ± 0.25
T
(0.080)
1808*
2.03
High value, low leakage and small size are difficult parameters to obtain
in capacitors for high voltage systems. AVX special high voltage MLC
chips capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power
converters, resonators in SMPS, and high voltage coupling/DC blocking.
These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to
make high voltage chips. These larger sizes require that special pre-
cautions be taken in applying these chips in surface mount assem-
blies. This is due to differences in the coefficient of thermal expansion
(CTE) between the substrate materials and chip capacitors. Apply heat
at less than 4°C per second during the preheat. Maximum preheat
temperature must be within 50°C of the soldering temperature.
The solder temperature should not exceed 230°C. Chips 1808 and
larger to use reflow soldering only.
Capacitors with X7R Dielectrics are not intended for AC line filtering
applications.
Contact plant for recommendations. Capacitors may require protective
surface coating to prevent external arcing.
C0G: J = ±5%
X7R: K = ±10%
L
Capacitance
Tolerance
M = ±20%
M = ±20%
K = ±10%
K
Z = +80%,
0.25 (0.010)
1.02 (0.040)
4.50 ± 0.3
3.20 ± 0.2
t
1812*
(0.100)
2.54
-20%
W
Applicable
Failure
A=Not
Rate
0.25 (0.010)
1.02 (0.040)
4.50 ± 0.3
6.40 ± 0.3
A
(0.100)
1825*
2.54
1= Pd/Ag
T = Plated Ni
Termination
and Solder
0.25 (0.010)
1.02 (0.040)
5.7 ± 0.4
5.0 ± 0.4
1
(0.130)
2220*
3.3
0.25 (0.010)
1.02 (0.040)
5.72 ± 0.25
6.35 ± 0.25
Packaging/Marking
1A = 7" Reel
3A = 13" Reel
9A = Bulk/Unmarked
(0.100)
2225*
2.54
millimeters (inches)
Unmarked
Unmarked
1A
0.76 (0.030)
1.52 (0.060)
9.14 ± 0.25
10.2 ± 0.25
(0.100)
3640*
2.54
39