HSMS-2820-BLKG Avago Technologies US Inc., HSMS-2820-BLKG Datasheet - Page 11

• Manufacturer Part Number: HSMS-2820-BLKG
• Description: DIODE SCHOTTKY RF SGL 15V SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-2820-BLKG

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Type: Schottky - Single
• Voltage - Peak Reverse (max): 15V
• Current - Max: 1A
• Capacitance @ Vr, F: 1pF @ 0V, 1MHz
• Resistance @ If, F: 12 Ohm @ 5mA, 1MHz
• Product: Schottky Diodes
• Peak Reverse Voltage: 15 V
• Forward Continuous Current: 1 A
• Configuration: Single
• Forward Voltage Drop: 0.5 V @ 0.01 A
• Maximum Reverse Leakage Current: 0.1 uA @ 1 V
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Capacitance Ct: 1pF
• Diode Case Style: SOT-23
• No. Of Pins: 3
• Series Resistance @ If: 6ohm
• Peak Reflow Compatible (260 C): Yes
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Breakdown Voltage: 15V
• Forward Voltage: 340mV
• Leaded Process Compatible: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1922; HSMS-2820-BLKG

Figure 28. Surface Mount Assembly Profile.
11
SMT Assembly
Reliable assembly of surface mount components is a com‑
plex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT packages, will reach solder reflow temperatures fast‑
er than those with a greater mass.
Avago’s diodes have been qualified to the time‑tempera‑
ture profile shown in Figure 28. This profile is representa‑
tive of an IR reflow type of surface mount assembly pro‑
cess.
After ramping up from room temperature, the circuit
board with components attached to it (held in place with
solder paste) passes through one or more preheat zones.
Tp
T
25
L
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Note 1: All temperatures refer to topside of the package, measured on the package body surface
Reflow Parameter
Average ramp‑up rate (Liquidus Temperature (T
Preheat
Ts(max) to TL Ramp‑up Rate
Time maintained above:
Peak Temperature (T
Time within 5 °C of actual
Peak temperature (t
Ramp‑down Rate
Time 25 °C to Peak Temperature
Ts
Ts
min
max
t 25
Preheat
P
P
°
)
ts
)
C to Peak
Temperature Min (T
Temperature Max (T
Time (min to max) (t
Temperature (T
Time (t
Ramp-up
Time
L
)
S(max)
L
)
to Peak)
Ramp-down
tp
S(min)
S(max)
S
)
)
The preheat zones increase the temperature of the board
and components to prevent thermal shock and begin
evaporating solvents from the solder paste. The reflow
zone briefly elevates the temperature sufficiently to pro‑
duce a reflow of the solder.
The rates of change of temperature for the ramp‑up and
cool‑down zones are chosen to be low enough to not
cause deformation of the board or damage to compo‑
nents due to thermal shock. The maximum temperature
in the reflow zone (T
These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
)
t
L
Lead-Free Assembly
3°C/ second max
150°C
200°C
60‑180 seconds
3°C/second max
217°C
60‑150 seconds
260 +0/‑5°C
20‑40 seconds
6°C/second max
8 minutes max
Critical Zone
T
L
to Tp
MAX
) should not exceed 260°C.