HSMP-3892-BLKG

... HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes Data Sheet Description/Applications The HSMP-389x series is optimized for switching appli- cations where low resistance at low current and low ca- pacitance are required. The HSMP-489x series products feature ultra low parasitic inductance. These products are specifically designed for use at frequencies which are much higher than the upper limit for conventional PIN diodes ...

Package Lead Code Identification, SOT-23/143 (Top View) SERIES SINGLE #0 #2 COMMON COMMON ANODE CATHODE #3 #4 UNCONNECTED DUAL ANODE PAIR 4890 #5 RING QUAD UNDER DEVELOPMENT Absolute Maximum Ratings T = +25°C [1] C ...

... Part Package Number Marking HSMP- Code Configuration [1] 489x GA Dual Anode T est Conditions Note: 1. SOT-23 package marking code is white; SOT-323 is laser marked 25°C Typical Parameters at C Part Number HSMP- 389x Test Conditions 3 Minimum Breakdown Voltage V BR 100 Measure I 10 µA R Minimum Maximum Breakdown Series Voltage Resistance V (V) R (ý 100 2 ...

... V – FORWARD VOLTAGE (V) F Figure 5. Forward Current vs. Forward Voltage Figure 7. HSMP-389L Unconnected Trio used in a Dual Voltage, High Isolation Switch. 120 Diode Mounted as a Series Attenuator in a 115 50 Ohm Microstrip and Tested at 123 MHz 110 105 100 ...

... Figure 10. HSMP-389U Series/Shunt Pair used in a 900 MHz Transmit/Receive Switch. 5 (continued out RF in Figure 9. HSMP-389T used in a Low Inductance Shunt Mounted Switch. Bias Xmtr C Rcvr Xmtr HSMP-389V Figure 11. HSMP-389V Series/Shunt Pair used in a 1.8 GHz Transmit/Receive Switch. RF out Ant λ Rcvr Bias Antenna λ 4 Rcvr ...

Typical Applications for Multiple Diode Products RF COMMON RF 1 BIAS 1 Figure 12. Simple SPDT Switch, Using Only Positive Current. RF COMMON RF 1 Figure 14. Switch Using Both Positive and Negative Bias Current. 6 (continued ...

... Typical Applications for HSMP-489x Low Inductance Series Microstrip Series Connection for HSMP-489x Series In order to take full advantage of the low inductance of the HSMP-489x series when using them in series ap- plications, both lead 1 and lead 2 should be connected together, as shown in Figure 17 HSMP-489x Figure 16. Internal Connections. Figure 16. Internal Connections. Figure 17. Circuit Layout. Figure 17. Circuit Layout. ...

Assembly Information 0.026 0.035 0.016 Figure 22. PCB Pad Layout, SOT-363. (dimensions in inches). 0.026 0.035 0.016 Figure 23. PCB Pad Layout, SOT-323. (dimensions in inches). 0.037 0.95 0.035 0.9 0.031 0.8 inches DIMENSIONS IN mm Figure 24. PCB Pad ...

SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g vapor phase reflow, wave soldering, etc.) cir- cuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity ...

Package Dimensions Outline 23 (SOT-23 XXX SYMBOL Notes: e2 XXX-package marking E Drawings are not to scale L Outline 143 (SOT-143 ...

... Package Characteristics Lead Material Lead Finish Maximum Soldering Temperature Minimum Lead Strength Typical Package Inductance Typical Package Capacitance Ordering Information Specify part number followed by option. For example: HSMP - 389x - xxx Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement. ” Device Orientation REEL CARRIER TAPE ...

Tape Dimensions and Product Orientation For Outline SOT- MAX A 0 DESCRIPTION SYMBOL CAVITY LENGTH A 3.15 0 WIDTH B 2.77 0 DEPTH K 1.22 0 PITCH P 4.00 BOTTOM HOLE DIAMETER D ...

Tape Dimensions and Product Orientation For Outlines SOT-323, -363 DESCRIPTION SYMBOL CAVITY LENGTH A 0 WIDTH B 0 DEPTH K 0 PITCH P BOTTOM HOLE DIAMETER D 1 PERFORATION DIAMETER D PITCH ...