B32673Z5155K EPCOS (TDK), B32673Z5155K Datasheet - Page 16

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B32673Z5155K

Manufacturer Part Number
B32673Z5155K
Description
Cap Film 1.5uF 520VDC PP 10% 26.5 X 12 X 22mm RDL 22.5mm Bulk
Manufacturer
EPCOS (TDK)
Datasheet

Specifications of B32673Z5155K

Package/case
26.5(Max) X 12(Max) X 22(Max)
Mounting
Through Hole
Capacitance Value
1.5 uF
Voltage
520 Vdc
Dielectric
PP
Lead Pitch For Radial
22.5 mm
Product Length
26.5(Max) mm
Product Depth
12(Max) mm
Tolerance
10 %
Operating Temperature
-55 to 110 °C

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
B32673Z5155K000
Manufacturer:
TDK-EPCOS
Quantity:
30 000
Part Number:
B32673Z5155K189
Manufacturer:
TDK-EPCOS
Quantity:
30 000
Part Number:
B32673Z5155K289
Manufacturer:
TDK-EPCOS
Quantity:
30 000
3
In many applications, finished circuit assemblies are embedded in plastic resins. In this case,
both chemical and thermal influences of the embedding ("potting") and curing processes must be
taken into account.
Our experience has shown that the following potting materials can be recommended: non-flexible
epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum
curing temperature of 100 C.
Caution:
Consult us first if you wish to embed uncoated types!
Please read Cautions and warnings and
Important notes at the end of this document.
Embedding of capacitors in finished assemblies
B32671Z ... B32673Z
Power Factor Correction
Page 16 of 22

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