HSMP-389T-TR1G Avago Technologies US Inc., HSMP-389T-TR1G Datasheet - Page 9

• Manufacturer Part Number: HSMP-389T-TR1G
• Description: DIODE PIN SWITCH 100V SOT-363
• Manufacturer: Avago Technologies US Inc.
• Type: Switchr

Specifications of HSMP-389T-TR1G

• Diode Type: PIN - Single
• Voltage - Peak Reverse (max): 100V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
• Resistance @ If, F: 2.5 Ohm @ 5mA, 100MHz
• Package / Case: SC-70-6, SC-88, SOT-363
• Diode Case Style: SOT-363
• No. Of Pins: 6
• Capacitance Ct: 0.2pF
• Termination Type: SMD
• Mounting Type: Surface Mount
• Breakdown Voltage: 100V
• Series Resistance @ If: 2.5ohm
• Operating Temperature Classification: Military
• Reverse Voltage: 100V
• Mounting: Surface Mount
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Capacitance: 0.2pF
• Forward Test Current If: 1A
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Compliant

SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process,
and equipment factors, including: method of heating
(e.g., IR or vapor phase reflow, wave soldering, etc.) cir-
cuit board material, conductor thickness and pattern,
type of solder alloy, and the thermal conductivity and
thermal mass of components. Components with a low
mass, such as the SOT package, will reach solder reflow
temperatures faster than those with a greater mass.
Avago Technologies’ diodes have been qualified to the
time-temperature profile shown in Figure 26. This profile
is representative of an IR reflow type of surface mount
assembly process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
Figure 26. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Note 1: All temperatures refer to topside of the package, measured on the package body surface
9
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (T
Preheat
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (T
Time within 5 °C of actual Peak temperature (t
Ramp-down Rate
Time 25 °C to Peak Temperature
Tp
T
25
L
Ts
Ts
min
max
P
)
t 25
Preheat
°
ts
C to Peak
Temperature Min (T
Temperature Max (T
Time (min to max) (t
Temperature (T
Time (t
P
L
)
)
Ramp-up
S(max)
Time
to Peak)
L
)
S(min)
S(max)
S
)
Ramp-down
tp
)
)
zones. The preheat zones increase the temperature of
the board and components to prevent thermal shock
and begin evaporating solvents from the solder paste.
The reflow zone briefly elevates the temperature suffi-
ciently to produce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo-
nents due to thermal shock. The maximum temperature
in the reflow zone (T
These parameters are typical for a surface mount assem-
bly process for Avago Technologies diodes. As a general
guideline, the circuit board and components should be
exposed only to the minimum temperatures and times
necessary to achieve a uniform reflow of solder.
t
L
Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max
Critical Zone
T
L
to Tp
MAX
) should not exceed 260°C.