HSMP-389C-TR1 Avago Technologies US Inc., HSMP-389C-TR1 Datasheet - Page 8

• Manufacturer Part Number: HSMP-389C-TR1
• Description: DIODE PIN SWITCH 100V 1A SOT-323
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-389C-TR1

• Package / Case: SC-70-3, SOT-323-3
• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 100V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
• Resistance @ If, F: 2.5 Ohm @ 5mA, 100MHz
• Series Resistance @ If: 2.5ohm
• Peak Reflow Compatible (260 C): No
• Reel Quantity: 3000
• Pin Configuration: Series Pair
• Leaded Process Compatible: No
• Mounting Type: Surface Mount
• Breakdown Voltage: 100V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant

Assembly Information
Figure 22. PCB Pad Layout, SOT-363.
(dimensions in inches).
Figure 23. PCB Pad Layout, SOT-323.
(dimensions in inches).
Figure 24. PCB Pad Layout, SOT-23.
Figure 25. PCB Pad Layout, SOT-143.
0.037
DIMENSIONS IN
0.075
0.95
0.035
DIMENSIONS IN
1.9
0.035
0.9
0.035
0.047
1.2
0.026
0.026
0.112
0.079
2.85
0.071
0.031
inches
1.8
2
0.8
mm
inches
mm
0.016
0.016
0.033
0.85
0.031
0.041
0.8
1.05
0.07
0.033
0.033
0.85
0.85
0.075
0.037
0.95
0.108
0.079
2.75
2.0
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s diodes have been
qualified to the time-temperature
profile shown in Figure 26. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
Figure 26. Surface Mount Assembly Profile.
250
200
150
100
50
0
0
60
Preheat
Zone
120
TIME (seconds)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
exceed 235°C.
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
Reflow
Zone
8
180
Cool Down
Zone
MAX
) should not
240
T
MAX
300