MMBFJ309LT1G ON Semiconductor, MMBFJ309LT1G Datasheet

JFET SS N-CHAN 25V SOT23

MMBFJ309LT1G

Manufacturer Part Number
MMBFJ309LT1G
Description
JFET SS N-CHAN 25V SOT23
Manufacturer
ON Semiconductor
Datasheets

Specifications of MMBFJ309LT1G

Transistor Type
N-Channel JFET
Voltage - Rated
25V
Current Rating
30mA
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Configuration
Single
Transistor Polarity
N-Channel
Drain Source Voltage Vds
25 V
Gate-source Breakdown Voltage
25 V
Drain Current (idss At Vgs=0)
12 mA to 30 mA
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Mounting Style
SMD/SMT
Capacitance, Input
5 pf
Capacitance, Reverse Recovery
2.5 pF
Channel Type
N-Channel
Current, Drain
30 mA
Current, Gate
10 mA
Current, Gate Reverse
–1 nA
Noise, Input Voltage
10 nV/√Hz
Noise, Voltage
10 nV/√Hz
Package Type
SOT-23 (TO-236)
Polarization
N-Channel
Power Dissipation
225 mW
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
–65 °C
Voltage, Breakdown, Gate To Source
–25 V
Voltage, Drain To Source
25 V
Voltage, Gate To Source, Breakdown
–25 V
Voltage, Gate To Source, Cut-off
–4 V
Voltage, Gate To Source, Forward
1 V
Breakdown Voltage Vbr
-25V
Gate-source Cutoff Voltage Vgs(off) Max
-4V
Power Dissipation Pd
225mW
Operating Temperature Range
-55°C To +150°C
No. Of Pins
3
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power - Output
-
Frequency
-
Gain
-
Noise Figure
-
Current - Test
-
Voltage - Test
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MMBFJ309LT1GOS
MMBFJ309LT1GOS
MMBFJ309LT1GOSTR

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MMBFJ309LT1G,
MMBFJ310LT1G
JFET - VHF/UHF Amplifier
Transistor
N−Channel
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.062 in.
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 4
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Drain−Source Voltage
Gate−Source Voltage
Gate Current
Total Device Dissipation FR−5 Board,
(Note 1) T
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
Compliant
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
A
= 25°C
Characteristic
Rating
Symbol
Symbol
T
R
J
V
V
P
, T
I
qJA
DS
GS
G
D
stg
−55 to +150
Value
Max
225
556
1.8
25
25
10
1
mW/°C
mAdc
°C/W
Unit
Unit
Vdc
Vdc
mW
°C
†For information on tape and reel specifications,
MMBFJ309LT1G
MMBFJ310LT1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Date Code orientation and/or overbar may
Device
vary depending upon manufacturing location.
1
(Note: Microdot may be in either location)
6x = Device Code
M
G
ORDERING INFORMATION
2
GATE
3
MARKING DIAGRAM
= Date Code*
= Pb−Free Package
http://onsemi.com
x = U for MMBFJ309LT1
x = T for MMBFJ310LT1
3
1
(Pb−Free)
(Pb−Free)
Package
SOT−23
SOT−23
6x M G
Publication Order Number:
G
SOT−23 (TO−236)
1 DRAIN
2 SOURCE
CASE 318
STYLE 10
3,000 / Tape & Reel
3,000 / Tape & Reel
MMBFJ309LT1/D
Shipping

Related parts for MMBFJ309LT1G

MMBFJ309LT1G Summary of contents

Page 1

... R 556 °C/W qJA −55 to +150 °C J stg MMBFJ309LT1G MMBFJ310LT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com 2 SOURCE 3 GATE 1 DRAIN 3 SOT−23 (TO−236) ...

Page 2

ELECTRICAL CHARACTERISTICS (T Characteristic OFF CHARACTERISTICS Gate−Source Breakdown Voltage (I = −1.0 mAdc Gate Reverse Current (V = −15 Vdc) GS Gate Reverse Current (V = −15 Vdc Gate Source Cutoff Voltage (V ...

Page 3

I Characteristics versus Gate−Source Voltage 100 1.0 k GS(off GS(off) 100 0.01 0.1 0.2 0.3 0.5 1.0 2.0 3.0 5 ...

Page 4

25° 6 100 200 300 500 f, FREQUENCY (MHz) Figure 4. Common−Gate Y Parameter ...

Page 5

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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