HM2R65PA5108N9LF FCI SA, HM2R65PA5108N9LF Datasheet - Page 3

• Manufacturer Part Number: HM2R65PA5108N9LF
• Description: Conn Hard Metric F 125 POS 2mm Press Fit RA Thru-Hole
• Manufacturer: FCI SA
• Type: Hard Metricr

Specifications of HM2R65PA5108N9LF

• Pitch: 2 mm
• Number Of Rows: 5
• Number Of Contacts: 125
• Termination Method: Press Fit
• Mounting: Through Hole
• Contact Plating: Gold Over Nickel

Features & benefits
Qualifications
• Designed in accordance with IEC 917 and IEC
• Fits DIN 43356 and IEEE 1301 Hard Metric Practice.
• Qualified by Bellcore as defined by GR-1217-CORE, iss. 1,
• UL and CSA recognized.
Main features
Millipacs
featuring 5 and 8 contacts rows and 2 rows for shielding and
grounding.
Millipacs
specific types of modules with different functions and
features signal modules with up to 200 signal contacts per
50 mm module (in 8 row versions) as well as hybrid modules
for power, coax and/or FO contacts.
It provides 3 mating levels with 1.5 mm in between and a
2,5 mm wiping length for the shortest contact.
Both headers and receptacles are equipped with the well
known FCI “eye of the needle” press-fit section for stable
and reliable connections in the boards.
Misalignment of up to 2.5 mm and inclinations of 2° in both
directions can be overcome.
FCI’s unique 1 piece female concept offers the most solid
and reliable Hard Metric connector to the market. FCI is also
offering the most versatile shielding solutions on their female
concept: no shielding, top shielding, top and semi-rear
shielding* or fully shielded modules are all standard available.
Male modules are aligned next to each other without loss of
contact positions and integrated edge polarization does
guarantee a correct positioning of the different modules on
the board. Module types without guiding features (type B and
E) are to be used in between modules with the integrated
guiding areas only.
Small pin sizes and related small PT hole diameters both at
backplane and component board level guarantee that
conventional PCB routing, manufacturing and component
assembly can still be used. Maximum wiring density (up to 3
tracks in between 2 holes) can be achieved while no
additional layers are required.
* on request
61076-4-101.
November 1995.
®
®
is a standard 2.0 mm Interconnection System
is a modular system built up by a number of
Millipacs
®
HM
Allowed inclination
Allowed misalignment
3