RL0603FR070R15L Yageo, RL0603FR070R15L Datasheet - Page 7

• Manufacturer Part Number: RL0603FR070R15L
• Description: Res Thick Film 0603 150m Ohm 1% 1/10W ±800ppm/°C Molded SMD Paper T/R
• Manufacturer: Yageo
• Type: Thick Filmr

Specifications of RL0603FR070R15L

• Case Size: 0603
• Resistance Value: 150 mOhm
• Power Rating: 1/10 W
• Tolerance: 1 %

TESTS AND REQUIREMENTS
TEST
Life/
Endurance
High Temperature
Exposure/
Endurance at upper
category temperature
Moisture Resistance
Thermal Shock
Short time overload
Board Flex/
Bending
Mar 22, 2010 V.5
Table 4 Test condition, procedure and requirements
Chip Resistor Surface Mount
TEST METHOD
IEC 60115-1 4.25.1
IEC 60068-2-2
MIL-STD-202G Method-106G
MIL-STD-202G Method-107G
IEC60115-1 4.13
IEC 60068-2-21
RL
PROCEDURE
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at maximum operating
temperature depending on specification,
unpowered
No direct impingement of forced air to the
parts
Tolerances: 125±5 °C
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
-55/+125 °C
Note: Number of cycles required is 300.
Devices unmounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
temperature
Device mounted on PCB test board as
described, only 1 board bending required
3 mm bending
Bending time: 60±5 seconds
Ohmic value checked during bending
SERIES
0402 to 2512
REQUIREMENTS
±2%
±1%
±2%
±1%
±2%
No visible damage
±1%
No visible damage
Product specification
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