AR0603FR0711K5L Yageo, AR0603FR0711K5L Datasheet - Page 8

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AR0603FR0711K5L

Manufacturer Part Number
AR0603FR0711K5L
Description
Res Thick Film 0603 11.5K Ohm 1% 1/10W ±100ppm/°C Molded SMD Paper T/R
Manufacturer
Yageo
Type
Thick Filmr
Datasheet

Specifications of AR0603FR0711K5L

Case Size
0603
Resistance Value
11.5 KOhm
Power Rating
1/10 W
Tolerance
1 %
TEST
Solderability
Dec 23, 2008 V.7
- Resistance to
- Wetting
- Leaching
Soldering Heat
Chip Resistor Surface Mount
TEST METHOD
IPC/JEDECJ-STD-002B test B
IEC 60068-2-58
IPC/JEDECJ-STD-002B test D
IEC 60068-2-58
MIL-STD-202G-method 210F
IEC 60068-2-58
1
2
Dipping time: 3±0.5 seconds
PROCEDURE
Electrical Test not required
Magnification 50X
SMD conditions:
Leadfree solder, 260 °C, 30 seconds
immersion time
Condition B, no pre-heat of samples
Leadfree solder, 270 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
st
nd
AR
step: method B, aging 4 hours at 155 °C
step: leadfree solder bath at 245±3 °C
dry heat
SERIES
0402/0603/0805/1206 (RoHS Compliant)
Well tinned (≥95% covered)
No visible damage
REQUIREMENTS
No visible damage
±(1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Product specification
www.yageo.com
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