MAX19985AETX+ Maxim Integrated Products, MAX19985AETX+ Datasheet - Page 2

• Manufacturer Part Number: MAX19985AETX+
• Description: RF Mixer IC MIXER DOWNCONV earity, 700MHz to 10
• Manufacturer: Maxim Integrated Products

Specifications of MAX19985AETX+

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Dual, SiGe, High-Linearity, 700MHz to 1000MHz
Downconversion Mixer with LO Buffer/Switch
ABSOLUTE MAXIMUM RATINGS
V
LO1, LO2 to GND ...............................................................±0.3V
Any Other Pins to GND...............................-0.3V to (V
RFMAIN, RFDIV, and LO_ Input Power ..........................+15dBm
RFMAIN, RFDIV Current (RF is DC shorted
Continuous Power Dissipation (Note 1) ..............................8.8W
+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
ters are production tested, unless otherwise noted.)
+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
( Typical Application Circuit , V
are guaranteed by design and not production tested, unless otherwise noted.)
Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
LOSEL Input High Voltage
LOSEL Input Low Voltage
LOSEL Input Current
Supply Voltage
Supply Current
LOSEL Input High Voltage
LOSEL Input Low Voltage
CC
to GND through balun)....................................................50mA
_______________________________________________________________________________________
to GND ...........................................................-0.3V to +5.5V
pad is known while the device is soldered down to a PCB. See the Applications Information section for details. The junction
temperature must not exceed +150°C.
known. The junction temperature must not exceed +150°C.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
PARAMETER
is the temperature on the exposed pad of the package. T
CC
CC
J
= 3.0V to 3.6V, T
= T
= 4.75V to 5.25V, T
A
SYMBOL
SYMBOL
+ (θ
I
IH
V
V
I
I
V
V
V
V
CC
CC
CC
J
CC
, I
IH
IH
IL
IL
JA
= T
IL
x V
C
+ (θ
CC
R2 = R5 = 600Ω
Total supply current, V
C
x I
JC
= -40°C to +85°C. Typical values are at V
CC
C
CC
= -40°C to +85°C. Typical values are at V
x V
+ 0.3V)
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CC
CONDITIONS
CONDITIONS
). This formula can be used when the temperature of the exposed
A
θ
θ
Operating Temperature Range (Note 4) .....T
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
JA
JC
is the ambient temperature of the device and PCB.
CC
(Notes 2, 3)..............................................................+38°C/W
(Note 3).....................................................................7.4°C/W
= 3.3V
CC
CC
MIN
4.75
MIN
-10
= 3.3V, T
3.0
2
= 5.0V, T
TYP
TYP
330
C
280
3.3
0.8
5
2
= +25°C, all parameters
C
= +25°C, all parame-
C
= -40°C to +85°C
MAX
MAX
5.25
+10
380
0.8
3.6
UNITS
UNITS
mA
mA
µA
V
V
V
V
V
V