BC817,235 NXP Semiconductors, BC817,235 Datasheet
BC817,235
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BC817 /T3
BC817 /T3
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BC817,235 Summary of contents
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BC817; BC817W; BC337 45 V, 500 mA NPN general-purpose transistors Rev. 06 — 17 November 2009 1. Product profile 1.1 General description NPN general-purpose transistors. Table 1. Type number BC817 BC817W [1] BC337 [1] Also available in SOT54A and SOT54 ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOT23 SOT323 SOT54 SOT54A SOT54 variant BC817_BC817W_BC337_6 Product data sheet BC817; BC817W; BC337 45 V, 500 mA NPN general-purpose transistors Pinning Description base emitter collector base emitter collector emitter base collector emitter base collector emitter base collector Rev. 06 — ...
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... NXP Semiconductors 3. Ordering information Table 4. Type number BC817 BC817W [2] BC337 [1] Valid for all available selection groups. [2] Also available in SOT54A and SOT54 variant packages (see 4. Marking Table 5. Type number BC817 BC817-16 BC817-25 BC817-40 BC817W BC817-16W BC817-25W BC817-40W BC337 BC337-16 BC337-25 BC337-40 [ made in Hong Kong ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot T stg amb [1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. [2] Valid for all available selection groups. 6. Thermal characteristics Table 7 ...
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... NXP Semiconductors 7. Characteristics Table 8. Characteristics ° unless otherwise specified. amb Symbol Parameter I collector-base cut-off current CBO I emitter-base cut-off current EBO h DC current gain FE BC817; BC817W; BC337 BC817-16; BC817-16W; BC337-16 BC817-25; BC817-25W; BC337-25 BC817-40; BC817-40W; BC337- current gain FE V collector-emitter saturation CEsat ...
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... NXP Semiconductors 400 h FE 300 (1) 200 (2) (3) 100 0 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. Selection -16: DC current gain as a function of collector current; typical values 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 3. Selection -40: DC current gain as a function of collector current ...
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... NXP Semiconductors 10 V BEsat (V) 1 (1) (2) (3) −1 10 − −55 °C (1) T amb = 25 °C (2) T amb = 150 °C (3) T amb Fig 4. Selection -16: Base-emitter saturation voltage as a function of collector current; typical values −55 °C (1) T amb = 25 °C (2) T amb = 150 °C (3) T amb Fig 6. Selection -40: Base-emitter saturation voltage as a function of collector current ...
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... NXP Semiconductors 1 V CEsat (V) −1 10 (1) (2) (3) −2 10 − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 7. Selection -16: Collector-emitter saturation voltage as a function of collector current; typical values 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 9. Selection -40: Collector-emitter saturation voltage as a function of collector current ...
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... NXP Semiconductors 1.2 ( (A) 0.8 0 °C T amb ( (10 1 Fig 10. Selection -16: Collector current as a function of collector-emitter voltage; typical values BC817_BC817W_BC337_6 Product data sheet BC817; BC817W; BC337 45 V, 500 mA NPN general-purpose transistors 006aaa140 1.2 (4) (3) (2) ( (A) 0.8 (6) (7) (8) (9) 0.4 ...
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... NXP Semiconductors = 25 °C T amb ( (10 1 Fig 12. Selection -40: Collector current as a function of collector-emitter voltage; typical values BC817_BC817W_BC337_6 Product data sheet BC817; BC817W; BC337 45 V, 500 mA NPN general-purpose transistors 1.2 (6) (5) (4) ( (A) 0.8 0 Rev. 06 — 17 November 2009 006aaa142 (2) (1) ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max. 1.1 0.48 0.15 mm 0.1 0.9 0.38 0.09 OUTLINE VERSION IEC SOT23 Fig 13. Package outline SOT23 (TO-236AB) BC817_BC817W_BC337_6 Product data sheet BC817; BC817W; BC337 45 V, 500 mA NPN general-purpose transistors ...
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... NXP Semiconductors Plastic surface-mounted package; 3 leads DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.4 0.25 mm 0.1 0.8 0.3 0.10 OUTLINE VERSION IEC SOT323 Fig 14. Package outline SOT323 (SC-70) BC817_BC817W_BC337_6 Product data sheet BC817; BC817W; BC337 45 V, 500 mA NPN general-purpose transistors ...
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... NXP Semiconductors Plastic single-ended leaded (through hole) package; 3 leads DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 0.38 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION IEC SOT54 Fig 15 ...
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... NXP Semiconductors Plastic single-ended leaded (through hole) package; 3 leads (wide pitch DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 0.38 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE ...
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... NXP Semiconductors Plastic single-ended leaded (through hole) package; 3 leads (on-circle DIMENSIONS (mm are the original dimensions) UNIT 5.2 0.48 0.66 0.45 mm 5.0 0.40 0.55 0.38 Note 1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities. OUTLINE VERSION ...
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... NXP Semiconductors 9. Packing information Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BC817 SOT23 BC817W SOT323 BC337 SOT54 BC337 SOT54A BC337 SOT54A BC337 SOT 54 variant [1] For further information and the availability of packing methods, see ...
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... Revision history Document ID Release date BC817_BC817W_ 20091117 BC337_6 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Table 3 • Figure 13 “Package outline SOT23 • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 4 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 9 Packing information . . . . . . . . . . . . . . . . . . . . 16 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 11 Legal information ...